Fiber-based interferometer system for monitoring an imaging interferometer

ABSTRACT

Apparatus include a microscope including an objective and a stage for positioning a test object relative to the objective, the stage being moveable with respect to the objective, and a sensor system, that includes a sensor light source, an interferometric sensor configured to receive light from the sensor light source, to introduce an optical path difference (OPD) between a first portion and a second portion of the light, the OPD being related to a distance between the objective lens and the stage, and to combine the first and second portions of the light to provide output light, a detector configured to detect the output light from the interferometric sensor, a fiber waveguide configured to direct light between the sensor light source, the interferometric sensor and the detector, a tunable optical cavity in a path of the light from the sensor light source and the interferometric sensor, and an electronic controller in communication with the detector, the electronic controller being configured to determine information related to the OPD based on the detected output light.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of U.S. application Ser. No.12/509,098, entitled “SCAN ERROR CORRECTION IN LOW COHERENCE SCANNINGINTERFEROMETRY,” filed on Jul. 24, 2009, which claims priority toProvisional Patent Application No. 61/118,151, entitled “SCAN ERRORCORRECTION IN LOW COHERENCE SCANNING INTERFEROMETRY,” filed on Nov. 26,2008, the entire contents both of which are incorporated herein byreference.

TECHNICAL FIELD

The invention relates to interferometry.

BACKGROUND

Interferometric techniques are commonly used to obtain information abouta test object, such as to measure the profile of a surface of the testobject. To do so, an interferometer combines measurement light reflectedfrom the surface of interest with reference light reflected from areference surface to produce an interferogram. Fringes in theinterferogram are indicative of spatial variations between the surfaceof interest and the reference surface.

A variety of interferometric techniques have been successfully used tocharacterize a test object. These techniques include low coherencescanning techniques and phase-shifting interferometry (PSI) techniques.

With PSI, the optical interference pattern is recorded for each ofmultiple phase-shifts between the reference and test wavefronts toproduce a series of optical interference patterns that span, forexample, at least a half cycle of optical interference (e.g., fromconstructive, to destructive interference). The optical interferencepatterns define a series of intensity values for each spatial locationof the pattern, wherein each series of intensity values has a sinusoidaldependence on the phase-shifts with a phase-offset equal to the phasedifference between the combined test and reference wavefronts for thatspatial location. Using numerical techniques, the phase-offset for eachspatial location is extracted from the sinusoidal dependence of theintensity values to provide a profile of the test surface relative thereference surface. Such numerical techniques are generally referred toas phase-shifting algorithms.

The phase-shifts in PSI can be produced by changing the optical pathlength from the measurement surface to the interferometer relative tothe optical path length from the reference surface to theinterferometer. For example, the reference surface can be moved relativeto the measurement surface. Alternatively, the phase-shifts can beintroduced for a constant, non-zero optical path difference by changingthe wavelength of the measurement and reference light. The latterapplication is known as wavelength tuning PSI and is described, e.g., inU.S. Pat. No. 4,594,003 to G. E. Sommargren.

Low coherence scanning interferometry, on the other hand, scans theoptical path length difference (OPD) between the reference andmeasurement legs of the interferometer over a range comparable to (e.g.,so that there is at least some modulation of the coherence envelopewhere interference fringes occur), or larger than, the coherence lengthof the interfering test and reference light, to produce a scanninginterferometry signal for each camera pixel used to measure theinterferogram. The coherence length of the light is relatively shortcompared to the coherence length of light commonly used for PSI andrelative to the range of OPD's scanned in a measurement. A low coherencelength can be produced, for example, by using a white-light source,which is referred to as scanning white light interferometry (SWLI). Atypical scanning white light interferometry (SWLI) signal is a fewfringes localized near the zero OPD position. The signal is typicallycharacterized by a sinusoidal carrier modulation (the “fringes”) withbell-shaped fringe-contrast envelope. The conventional idea underlyinglow coherence interferometry metrology is to make use of thelocalization of the fringes to measure surface profiles.

Low coherence interferometry processing techniques include two principletrends. The first approach is to locate the peak or center of theenvelope, assuming that this position corresponds to the zero OPD of atwo-beam interferometer for which one beam reflects from the objectsurface. The second approach is to transform the signal into thefrequency domain and calculate the rate of change of phase withwavelength, assuming that an essentially linear slope is directlyproportional to object position. See, for example, U.S. Pat. No.5,398,113 to Peter de Groot. This latter approach is referred to asFrequency Domain Analysis (FDA).

Low coherence scanning interferometry can be used to measure surfacetopography and/or other characteristics of objects having complexsurface structures, such as thin film(s), discrete structures ofdissimilar materials, or discrete structures that are underresolved bythe optical resolution of an interference microscope. Such measurementsare relevant to the characterization of flat panel display components,semiconductor wafer metrology, and in-situ thin film and dissimilarmaterials analysis. See, e.g., U.S. Patent Publication No.US-2004-0189999-A1 by Peter de Groot et al. entitled “PROFILING COMPLEXSURFACE STRUCTURES USING SCANNING INTERFEROMETRY” and published on Sep.30, 2004, the contents of which are incorporated herein by reference,and U.S. Patent Publication No. US-2004-0085544-A1 by Peter de Grootentitled “INTERFEROMETRY METHOD FOR ELLIPSOMETRY, REFLECTOMETRY, ANDSCATTEROMETRY MEASUREMENTS, INCLUDING CHARACTERIZATION OF THIN FILMSTRUCTURES” and published on May 6, 2004, the contents of which areincorporated herein by reference.

SUMMARY

The disclosure relates generally to methods and systems for reducinguncertainty in interferometry measurements. More specifically, themethods and systems are used to reduce errors that can arise in lowcoherence interferometry measurements when an actual optical path lengthdifference (OPD) increment between successive detector frames during themeasurement are perturbed from a nominal OPD. These errors arise fromsources like vibration and are referred to as “scan errors.”

A potential solution to the scan error problem is to characterize ormonitor the true scan history of the instrument and to feed thisinformation into the signal processing to correct for this information.One way to gather this information is with a laser displacementmeasuring interferometer (DMI) working in tandem with theinterferometer. More generally, the scan history can be obtained using amonitor interference signal obtained using a source having a coherencelength longer than the OPD scan range. While information about the scanhistory can be obtained from monitor interference signals usingconventional PSI algorithms, the applicants have realized that suchanalysis would not capture information about scan errors occurring dueto vibrations having frequencies higher than the frame rate of theinterferometer's detector. However, where multiple monitor signals areobtained having different phases, the monitor signals can be used todetermine information about scan errors caused by such high frequencyvibrations.

Accordingly, during a low coherence interferometric data acquisition,disclosed systems simultaneously collect interference data over severalpoints in the field of view (FOV) having a range of phase orinterference frequency offsets, using the same interferometer optics asfor the low coherence interferometric data acquisition, but with aseparate detector or equivalent detection means operating at a singlewavelength (or wavelength band providing light having a sufficientlylarge coherence length). A processor determines the scan-motion historyfrom the monitor interference data, including vibration over avibrational frequency range that includes both low and high vibrationalfrequencies. This information is then used to correct the broadbandinterferometric data prior to any further processing.

In general, the disclosed methods and systems can be applied tointerference microscopes configured to image the test object onto thedetector (conventional imaging), or interference microscopes configuredso that the location on the detector corresponds to a particular angleof incidence of the illumination on the test object (e.g., by imaging apupil plane of the microscope onto the detector). This latterconfiguration is referred to herein as Pupil-Plane SWLI (PUPS).Conventional imaging systems provide, for example, 3D profiles ofsurface features of a test object. PUPS, on the other hand, providesdetailed structure information for a small area of the surface,including multi-layer film thickness and index analysis, and thedimensions of optically-unresolved features within the measurement area.Both measurement modes typically use a multi-element detector such as avideo camera to collect data over a field of view (FOV) that covers asurface image or a pupil-plane image.

In conventional imaging and PUPS, data is typically acquired over a timescale of 1/10 to several seconds, and both modes are sensitive tomechanical disturbances occurring during the data acquisition time,where scan errors cause an increase in system noise.

In the measurement of optically-unresolved features using PUPS, thedimensional resolution of the system is inversely proportional to thenoise in the interferometrically-derived spectral amplitude, which is acomplex function of vibration and scanning errors. It is believed thatby reducing the noise due to vibration and scan, a PUPS tool'sresolution may be substantially enhanced, and may be advantageousallowing PUPS systems to keep up with, e.g., semiconductor processingmetrology as features decrease in size.

Low coherence measurements are increasingly employed in productionscenarios with poorly-controlled environments, leading to significantvibrational noise. Given the desire to employ advanced optical 3Dmetrology in these situations, vibration solutions, such as thosepresented in the methods and systems disclosed herein, are highlydesirable.

In another aspect, the disclosure features methods of correcting lowcoherence interferometry data once information about scan errors isobtained. While the scan error information can be obtained using thetechniques discussed above, other implementations are also possible. Forexample, information about scan errors can be obtained in a variety ofways, such as, by use of accelerometers, touch probes, capacitive gages,air gages, optical encoders, and/or techniques based on interpretationof the low coherence interferometry data themselves.

Typically, once acquired, the information is fed into further dataprocessing resulting in data that is as close as possible to that of anundisturbed system. In general, the information about scan errors can beused in a variety of ways to improve the accuracy of scanninginterferometry measurements.

In some embodiments, the data processing involves spectral analysismethods that use the scan-motion information and replaces a conventionaldiscrete Fourier algorithm in one part of the data processing chain. Thespectral analysis methods, however, are generally applicable to any kindof data taken at uneven intervals and therefore not limited to certaintypes of application.

In certain embodiments, algorithms start by creating a set of basisfunctions that correspond to pure oscillatory signals at differentfrequencies sampled at the given uneven increments. Those basisfunctions appear as distorted waves. Next, the signal of interest isdecomposed into the basis functions by solving a linear equation system,revealing the frequency components of the signal of interest, similar towhat is computed by a regular discrete Fourier transform (DFT) in thecase of an evenly sampled data set.

Solving the linear equation system can be computationally done by meansof a matrix inversion, where the matrix columns are the basis functions.The inverted matrix is then multiplied by the vector containing the datathat is spectrally analyzed.

In the context of analyzing a low coherence signal obtained usingconventional imaging, it should be noted that the same inverted matrixcan be used for all pixels. The spectral analysis is therefore reducedto one matrix inversion and P multiplications of a matrix with a vector,where P is the number of pixels. In terms of computational cost, this isnot quite as fast as performing regular DFTs since highly optimizedalgorithms exist for DFTs.

Alternatively, the methods can be used when the signals recorded atdifferent locations of the field of view of an interferometer havedifferent (but known) sampling increments. For example, the incrementdistribution can be in some cases described as a combination of tilt andpiston perturbations of the interferometer cavity.

With little modification, the methods are also capable of compensatingthe effects of intensity fluctuations of the source (e.g. light sourcein a microscope). The basis functions are then pure oscillatory signalssampled at the known sampling positions, where each value is multipliedwith a factor that is proportional to the corresponding source intensitywhich has to be known from an independent measurement.

In some embodiments, information about the scan errors is determinedusing a compound reference. A compound reference is a reference objectthat has at least two reference interfaces. A reference interface canbe, e.g., a surface of an optical element, an interface between twooptical elements, an interface between on optical element and an coatinglayer, or an interface between two coating layers of an optical element.A primary reference interface functions as a conventional referenceinterface, providing reference light in an interferometry system forexamining an object surface, e.g., for surface height or othercharacteristics. In general, interference fringes generated by theprimary reference interface are visible on a primary camera or othertype of imaging device, which is connected to a computer or other dataacquisition and processing apparatus.

The secondary reference interface is configured provide information thatallows one to monitor the displacement of the test object relative tothe interference microscope while scanning the OPD of the interferencemicroscope. In general, the secondary reference interface ismechanically fixed with respect to the primary reference interface. Inother words, the relative position and orientation of the secondaryreference interface remains constant with respect to the primaryreference interface during data acquisition. The effect of the primaryreference and secondary reference interfaces is to provide afield-dependent complex effective reflectivity that varies at least inphase over the field of view of the system. In general, the effectivereflectivity is structured to facilitate determining an overall orlow-spatial frequency phase offset for the interference image.

In some embodiments, the interference effects of the secondary referenceinterface of the compound reference are visible to a second camera (alsoreferred to as a monitor camera) but not to the primary camera, whichsees only the interference between the primary reference interfacereflection and, e.g., the object surface reflection.

In some embodiments, the primary reference interface and the secondaryreference interface have a relative tilt, resulting in an effectivereflectivity with rapidly varying phase in the direction of the tilt.

In general, an analysis of the interference effects based on only thesecondary reference interface as viewed, for example, by the monitorcamera provides information that facilitates interpretation of theinterference effects based on only the primary reference interface asviewed by the primary camera.

To distinguish between the interference effects based on the primary andsecondary reference interfaces, the monitor camera can operate with asource spectrum that is different from that of the primary camera. Forexample, the monitor camera may view only spectrally narrowband light(e.g., monochromatic light), while the primary camera views spectrallybroadband light. Alternatively, or additionally, the monitor camera mayview light of a different wavelength than the light the reaches theprimary camera.

In addition or alternatively, the secondary reference interface can beadjusted to be at a sufficiently large angle or other geometric propertywith respect to the primary reference interface that its reflection maybe separated to be only detected by the monitor camera. For example,light reflected from the secondary reference may propagate along a paththat is blocked from the primary camera.

In some embodiments, information about scan errors can be obtained usingone or fiber-based DMI's. Fiber-based DMI's can include simple, compactsensors formed from commercially available components (e.g., telecomcomponents). In general, the fiber based sensor systems can beconfigured to operate independently from the interferometry system orcan be synchronized via, e.g., using a common processor for controllingthe systems. Individual sensors can be multi-plexed using, e.g., acommon source and a common reference cavity. Examples of sensor systemscan include components that provide illumination, heterodyning, lightdistribution, light detection, and phase extraction. In someembodiments, sensors of the sensor system are attached to differentparts of the interferometry system to monitor various scanning motions(degrees of freedom) performed for the measurement process. Informationfrom the fiber-based DMI's can be used for autofocusing theinterferometry system, e.g., in an interference microscope.

Various aspects of the invention are summarized as follows.

In general, in one aspect, the invention features apparatus thatincludes a broadband scanning interferometry system includinginterferometer optics for combining test light from a test object withreference light from a reference object to form an interference patternon a detector, wherein the test and reference light are derived from acommon light source. The interferometry system further includes ascanning stage configured to scan an optical path difference (OPD)between the test and reference light from the common source to thedetector and a detector system including the detector for recording theinterference pattern for each of a series of OPD increments, wherein thefrequency of each OPD increment defines a frame rate. The interferometeroptics are configured to produce at least two monitor interferometrysignals each indicative of changes in the OPD as the OPD is scanned,wherein the detector system is further configured to record the monitorinterferometry signals. The apparatus also includes an electronicprocessor electronically coupled to the detection system and scanningstage and configured to determine information about the OPD incrementswith sensitivity to perturbations to the OPD increments at frequenciesgreater than the frame rate.

Embodiments of the apparatus can include one or more of the followingfeatures and/or features of other aspects. For example, the scanningstage can be configured to scan the OPD over a range larger than acoherence length of the common source. The scanning stage can beconfigured to scan the OPD by varying a focus of the interferometeroptics relative to the test object. The scanning stage can be configuredto scan the OPD without varying a focus of the interferometer opticsrelative to the test object. The scanning stage can scan the OPD byvarying a position of the reference object with respect to theinterferometer optics.

In some embodiments, the interferometer optics include a Mirau objectiveor a Linnik objective. The interferometer optics can be configured toimage the test object to the detector.

The interferometer optics can define a pupil plane and are configured toimage the pupil plane to the detector. The scanning stage can beconfigured to scan the OPD in a manner where the OPD varies dependingupon the position in the pupil plane and determining the informationabout the OPD increments can include accounting for the locationdependence of the interference pattern. In certain embodiments, thescanning stage is configured to scan the OPD without varying a focus ofthe interferometer optics relative to the test object.

The interferometer optics can include an optical component configured toderive monitor light from output light provided by the interferometeroptics, wherein the output light comprises the test and reference light.The optical component can be a beam splitter configured to direct aportion of the output light to the detector and another portion of theoutput light to a secondary detector configured to record the monitorinterferometry signals. Alternatively, or additionally, the opticalcomponent includes a spectral filter configured to direct a portion ofthe output light to the detection system, wherein the monitorinterferometry signals are detected based on the portion of the outputlight. The portion can be a monochromatic portion of the output light.The monitor light can be derived from the common light source. Themonitor light can correspond to a spectral component of the test andreference light. The interference pattern can correspond to an intensityprofile of the output light. The monitor light can be derived from asecondary light source different from the common light source. Themonitor light source can have a coherence length longer than a coherencelength of the common light source.

In some embodiments, the electronic processor is configured to determineinformation about the OPD increments by matching a correspondingsinusoidal function to each of the at least two monitor interferometrysignals. The monitor interferometry signals can each include a pluralityof sampled data points acquired using the detector while scanning theOPD and matching the sinusoidal function to the monitor interferometrysignals can include interpolating the sampled data points to provide aninterpolated signal. Matching the sinusoidal function to the monitorinterferometry signals can further include associating a nominalinterference phase with each interferometry signal based on theinterpolated signal. Determining information about the OPD incrementscan include calculating a deviation in a measured phase of the monitorinterferometry signal based on the corresponding nominal interferencephase.

The at least two monitor interferometry signals can have differentinterference phases. The at least two monitor interferometry signals canhave different frequencies.

In some embodiments, the detector is a multi-element detector. Themulti-element detector can include elements configured to record the atleast two monitor interference signals.

The detector system can include a secondary detector separate from theprimary detector, the secondary detector being configured to record theat least two monitor interferometry signals. The secondary detector canbe a multi-element detector configured so that each of the elementsrecord a corresponding monitor interferometry signal.

The electronic processor can be further configured to determineinformation about the test object based on a primary interference signalcorresponding to the interference pattern recorded using the detector.Determining the information can include reducing uncertainty in theinformation based on the information about the OPD increments.

In general, in a further aspect, the invention features methods thatinclude providing a low coherence interferometry signal produced using ascanning interferometry system, wherein the scanning interferometrysystem produces the low coherence interferometry signal by combiningtest light from a test object with reference light from a referenceobject using interferometer optics to form an interference pattern on adetector which records the interference pattern while scanning anoptical path difference (OPD) between the test and reference light foreach of a series of OPD increments, where the frequency of each OPDincrement defines a frame rate. The methods further include providing atleast two monitor interferometry signals each produced using theinterferometer optics and each indicative of changes in the OPD as theOPD is scanned and determining, based on the monitor interferometrysignals, information about the OPD increments with sensitivity toperturbations to the OPD increments at frequencies greater than theframe rate.

Implementations of the method can include one or more of the followingfeatures and/or features of other aspects. For example, the test lightand reference light can be produced from a common source and the OPD isscanned over a range larger than a coherence length of the commonsource. Scanning the OPD can include varying a focus of theinterferometer optics relative to the test object. Scanning the OPD caninclude varying a position of the reference object with respect to theinterferometer optics. Providing the low coherence interferometry signalcan include imaging the test object to the detector.

In some embodiments, the interferometer optics define a pupil plane andproviding the low coherence interferometry signal includes imaging thepupil plane to the detector. Determining the information about the OPDincrements can include accounting for a location dependence of theinterference pattern.

Providing the at least two monitor interferometry signals can includederiving monitor light from output light provided by the interferometeroptics, wherein the output light comprises the test and reference light.The monitor light can be detected using the detector. The monitor lightcan be detected using a secondary detector different from the detectorused to record the interference pattern. Deriving the monitor light caninclude spectrally filtering the output light. In some embodiments, themonitor light is derived from the same light source as the test andreference light. In certain embodiments, the monitor light is derivedfrom a light source different from the source of the test and referencelight. The source of the monitor light can have a coherence lengthlonger than the source of the test and reference light.

Determining information about the OPD increments can include matching acorresponding sinusoidal function to each of the at least two monitorinterferometry signals. The monitor interferometry signals each caninclude a plurality of sampled data points and matching the sinusoidalfunction to the monitor interferometry signals can include interpolatingthe sampled data points to provide an interpolated signal. Matching thesinusoidal function to the monitor interferometry signals can furtherinclude associating a nominal interference phase with eachinterferometry signal based on the interpolated signal. Determininginformation about the OPD increments can further include calculating adeviation in a measured phase of the monitor interferometry signal basedon the corresponding nominal interference phase.

The at least two monitor interferometry signals can have differentinterference phases. The at least two monitor interferometry signals canhave different frequencies.

The methods can further include determining information about the testobject based on a primary interference signal corresponding to theinterference pattern recorded using the detector. Determining theinformation can reduce uncertainty in the information based on theinformation about the OPD increments.

In another aspect, the invention features processes for making a displaypanel that include providing a component of the display panel,determining information about the component using the methods orapparatus discussed previously, and forming the display panel using thecomponent. The component can include a pair of substrates separated by agap and the information can include information about the gap. Formingthe display panel can include adjusting the gap based on theinformation. Forming the display panel can include filling the gap witha liquid crystal material.

The component can include a substrate and a layer of a resist on thesubstrate. The information can include information about the thicknessof the layer of resist. The layer of resist can be a patterned layer,and the information can include information about a dimension or anoverlay error of a feature of the patterned layer. Forming the displaycan include etching a layer of material under the layer of resist.

The component can include a substrate that includes spacers and theinformation can include information about the spacers. Forming thedisplay can include modifying the spacers based on the information.

In general, in another aspect, the invention features methods thatinclude providing one or more interferometry signals for a test object,where the interferometry signals correspond to a sequence of opticalpath difference (OPD) values which are not all equally spaced from oneanother because of noise. The methods further include providinginformation about the unequal spacing of the sequence of OPD values,decomposing each of the interferometry signals into a contribution froma plurality of basis functions each corresponding to a differentfrequency and sampled at the unequally spaced OPD values, and usinginformation about the contribution from each of the multiple basisfunctions to each of the interferometry signals to determine informationabout the test object.

Implementations of the method can include one or more of the followingfeatures and/or features of other aspects. The decomposition of eachinterferometry signal into a contribution from each of the basisfunctions can include information about an amplitude and phase of eachbasis function to each interferometry signal. Each basis function can bea sinusoidal basis function sampled at the unequally spaced OPD values.The decomposition can be a linear decomposition.

The one or more interferometry signals can include multipleinterferometry signals corresponding to different locations of the testobject. The one or more interferometry signals can include multipleinterferometry signals corresponding to different locations of a pupilplane for an objective used to illuminate the test object to produce theinterferometry signals. Each of the interferometry signals can bedecomposed into contributions from the same plurality of basisfunctions.

Each interferometry signal can correspond to interference intensityvalues measured when test light emerging from the test object iscombined with reference light on a detector for each of the differentOPD values, wherein the test and reference light are derived from acommon source, and the OPD is the optical path length difference betweenthe test light and the reference light from the common source to thedetector.

The multiple basis functions can include non-orthogonal basis functions.The multiple basis functions can be linearly independent basisfunctions.

Decomposing the interferometry signals can include forming a matrix inwhich each column of the matrix corresponds to a basis function,inverting the matrix, and applying the inverted matrix to eachinterferometry signal. A number of elements of each basis function canexceed the number of basis functions.

Each interferometry signal can correspond to interference intensityvalues measured when test light emerging from the test object iscombined with reference light on a detector for each of the differentOPD values, where the test and reference light are derived from a commonlight source, and each basis function can account for variations of themeasured interference intensity values from nominal values correspondingto an error free interferometry signal. The variations can be due tovariations in an intensity level of the light source. The variations canbe due to finite frame integration times of the detector.

Providing the information about the unequal spacing of the sequence ofOPD values can include producing at least one monitor interferometrysignal indicative of changes in the OPD, where the monitorinterferometry signal is produced while the interferometry signalscorrespond to the sequence of OPD values are acquired. Information aboutthe unequal spacing of the sequence of OPD values can include producingmultiple monitor interferometry signals. The monitor interferometrysignal can be produced using the same interferometer optics used toproduce the interferometry signals corresponding to the sequence of OPDvalues.

Using the information can include constructing a correctedinterferometry signal based on the information about the contributionfrom each of the multiple basis functions to each of the interferometrysignals and determining information about the test object based on thecorrected interferometry signal.

The information about the unequal spacing of the sequence of OPD valuescan be produced using a sensor, such as, for example, a displacementmeasuring interferometer, an accelerometer, a touch probe, a capacitivegauge, an air gauge, or an optical encoder.

In another aspect, the invention features processes for making a displaypanel that include providing a component of the display panel,determining information about the component using the methods discussedin connection with the preceding aspect or using the apparatus discussedbelow, and forming the display panel using the component. The componentcan include a pair of substrates separated by a gap and the informationcan include information about the gap. Forming the display panel caninclude adjusting the gap based on the information. Forming the displaypanel can include filling the gap with a liquid crystal material.

The component can include a substrate and a layer of a resist on thesubstrate. The information can include information about the thicknessof the layer of resist. The layer of resist can be a patterned layer,and the information can include information about a dimension or anoverlay error of a feature of the patterned layer. Forming the displaycan include etching a layer of material under the layer of resist.

The component can include a substrate that includes spacers and theinformation can include information about the spacers. Forming thedisplay can include modifying the spacers based on the information.

In general, in another aspect, the invention features apparatus thatinclude an interferometry system comprising interferometer optics forcombining test light from a test object with reference light from areference object to form an interference pattern on a detector, wherethe test and reference light are derived from a common light source. Theinterferometry system further includes a scanning stage configured toscan an optical path difference (OPD) between the test and referencelight from the common source to the detector and a detector systemcomprising the detector for recording the interference pattern for eachof a series of OPD values thereby providing one or more interferometrysignals, and an electronic processor coupled to the detection system andconfigured to determine information about the test object based on theone or more interferometry signals. The sequence of OPD values are notall equally spaced from one another because of noise and the electronicprocessor is configured to determine the information about the testobject by decomposing each of the interferometry signals into acontribution from a plurality of basis functions each corresponding to adifferent frequency and sampled at the unequally spaced OPD values.

Embodiments of the apparatus can include one or more of the followingfeatures and/or features of other aspects. For example, theinterferometer optics can be configured to image the test object to thedetector. The interferometer optics can define a pupil plane and can beconfigured to image the pupil plane to the detector. The interferometercan be part of an interference microscope. The scanning stage can beconfigured to scan the OPD over a range larger than a coherence lengthof the common source.

In some embodiments, the apparatus further includes a sensor incommunication with the electronic processor, the sensor being configuredto provide information about the unequally spaced OPD values to theelectronic processor. The sensor can use the interferometer optics todirect a monitor beam to reflect from the test object. The sensor can bea displacement measuring interferometer, an accelerometer, a touchprobe, a capacitive gauge, an air gauge, or an optical encoder. In someembodiments, the sensor is configured to derive a first wavefront and asecond wavefront from input radiation and to combine the first andsecond wavefronts to provide output radiation comprising informationabout an optical path length difference between the paths of the firstand second wavefronts, the sensor including a reflective elementpositioned in the path of the first wavefront, the reflective elementbeing mounted on either the objective or the stage, and a fiberwaveguide configured to deliver the input radiation to the sensor or todeliver the output radiation from the sensor to a sensor detector.

In general, in another aspect, the invention features apparatus thatincludes a scanning interferometry system including interferometeroptics for directing test light to a test object over a range ofillumination angles and combining test light reflected from the testobject with reference light from a reference object to form aninterference pattern on a multi-element detector, where the test andreference light are derived from a common light source and theinterferometer optics are configured to direct at least a portion of thecombined light to the detector so that different elements of thedetector correspond to different illumination angles of the test objectby the test light. The interferometry system further includes a scanningstage configured to scan an optical path difference (OPD) between thetest and reference light from the common source to the detector and adetector system comprising the detector for recording the interferencepattern for each of a series of OPD increments, the scanninginterferometry system being further configured to produce at least onemonitor interferometry signal indicative of changes in the OPD as theOPD is scanned, and an electronic processor electronically coupled tothe detection system and scanning stage and configured to determineinformation about the OPD increments with sensitivity to perturbationsto the OPD increments

Embodiments of the apparatus can include one or more of the followingfeatures and/or features of other aspects. For example, theinterferometer optics can define a pupil plane and can be configured toimage the pupil plane to the detector. The scanning interferometrysystem is a broadband scanning interferometry system. The scanning stagecan be configured to scan the OPD over a range larger or shorter than acoherence length of the common source. The scanning interferometrysystem can be further configured to produce at least two monitorinterferometry signals each indicative of changes in the OPD as the OPDis scanned. The frequency of each OPD increment defines a frame rate andthe electronic processor can be configured to determine informationabout the OPD increments with sensitivity to perturbations to the OPDincrements at frequencies greater than the frame rate. The scanninginterferometry system can be configured to produce at least one monitorinterferometry signal using the interferometer optics.

In general, in another aspect, the invention features apparatus thatincludes an interference microscope including an objective and a stagemoveable relative to the objective. The apparatus also includes a sensorconfigured to derive a first wavefront and a second wavefront from inputradiation and to combine the first and second wavefronts to provideoutput radiation comprising information about an optical path lengthdifference between the paths of the first and second wavefronts, thesensor including a reflective element positioned in the path of thefirst wavefront, the reflective element being mounted on either theobjective or the stage. The apparatus includes a fiber waveguideconfigured to deliver the input radiation to the sensor or to deliverthe output radiation from the sensor to a corresponding detector, and anelectronic controller configured to monitor a displacement of the stagerelative to the objective based on the information from the sensor.

Embodiments of the apparatus can include one or more of the followingfeatures and/or features of other aspects. For example, the interferencemicroscope can be a low coherence scanning interference microscope. Theinterference microscope can include interferometer optics and adetector, the interferometer optics being configured to image a testobject positioned on the stage to the detector. The interferencemicroscope can include interferometer optics and a detector, where theinterferometer optics define a pupil plane and are configured to imagethe pupil plane to the detector.

The objective can be a Mirau objective or a Linnik objective.

In another aspect, the invention features interferometry systems thatinclude a detector sub-system comprising a monitor detector,interferometer optics for combining test light from a test object withprimary reference light from a first reference interface and secondaryreference light from a second reference interface to form a monitorinterference pattern on a monitor detector, wherein the first and secondreference interfaces are mechanically fixed with respect to each otherand the test light, a scanning stage configured to scan an optical pathdifference (OPD) between the test light and the primary and secondaryreference light to the monitor detector while the detector sub-systemrecords the monitor interference pattern for each of a series of OPDincrements, and an electronic processor electronically coupled to thedetector sub-system and the scanning stage, the electronic processorbeing configured to determine information about the OPD increments basedon the detected monitor interference pattern.

Embodiments of the interferometry systems can include one or more of thefollowing features and/or features of other aspects. For example, thedetector sub-system can include a primary detector and theinterferometer optics are arranged to combine test light and firstreference light to form a primary interference pattern on the primarydetector, the primary interference pattern being different from themonitor interference pattern. The electronic processor can be configuredto determine information about the test object based on the detectedprimary interference pattern. Determining information about the testobject can include reducing uncertainty in the information about thetest object due to vibrations in the interferometry system based on theinformation about the OPD increments.

The interferometer optics can be configured so that the primary detectorreceives none of the secondary reference light. The interferometeroptics comprise an aperture stop positioned to transmit test light andprimary reference light to the primary detector, but block secondaryreference light from the primary detector. The interferometer optics caninclude a wavelength filter that transmits test light and primaryreference light to the primary detector, but blocks secondary referencelight from the primary detector.

The monitor detector can be a multi-element detector and the first andsecond reference interfaces can be configured so that a relative phasedifference between the primary and secondary reference light variesacross a field of view of the multi-element detector.

The first and second reference interfaces can be arranged so that theprimary and secondary reference light propagate along non-parallel pathsat the monitor detector. The first and second reference interfaces canbe surfaces. The first and second reference interfaces can correspond toopposing surfaces of a common optical element. The common opticalelement can be a wedge. The first and second interfaces can correspondto surfaces of different optical elements.

The second reference interface can be a planar interface. For example,the primary reference interface is a planar interface. In someembodiments, the primary interface is a non-planar interface. Thenon-planar interface can be a spherical interface. The primary referenceinterface can be an aspherical interface.

The interferometer optics can define an optical axis and the first andsecond interfaces are oriented at different angles with respect to theoptical axis.

The interferometry system can include an illumination sub-system forproducing the test light, primary reference light, and secondaryreference light. The illumination sub-system can include a common lightsource that produces the test light, primary reference light, andsecondary reference light. In some embodiments, the common source is abroadband source. The illumination sub-system can include a primarysource for providing the test light and primary reference light and amonitor source for providing the secondary reference light. The primarysource can be a broadband source. The monitor source can be a narrowbandsource (e.g., a monochrome source).

The illumination sub-system can include a light source for providing atleast the test light and the primary reference light and the scanningstage is configured to scan the OPD over a range larger than a coherencelength of the light source. The illumination sub-system can include alight source for providing at least the test light and the primaryreference light and the scanning stage is configured to scan the OPDover a range shorter than a coherence length of the light source.

The interferometer optics can be configured to image the test object toa multi-element detector in the detector sub-system. The interferometeroptics can define a pupil and the interferometer optics can beconfigured to image the pupil to a multi-element detector in thedetector sub-system. The multi-element detector can be the monitordetector.

The interferometer optics can be arranged as a Fizeau interferometer, aLinnik interferometer, or a Mirau interferometer.

In general, in another aspect, the invention features methods thatinclude combining test light from a test object with primary referencelight from a first reference interface and secondary reference lightfrom a second reference interface to form a monitor interference patternon a monitor detector, wherein the first and second reference interfacesare mechanically fixed with respect to each other and the test light,scanning an optical path difference (OPD) between the test light and theprimary and secondary reference light to the monitor detector, recordingthe monitor interference pattern for each of a series of OPD increments,and determining information about the OPD increments based on thedetected monitor interference pattern. Implementations of the methodscan include any of the features of other aspects.

In general, in a further aspect, the invention feature interferometrysystems that include interferometer optics for combining test light froma test object with primary reference light from a first referenceinterface and secondary reference light from a second referenceinterface to form a first interference pattern on a monitor detector,the interferometer optics also combining test light with primaryreference light to form a second interference pattern on a primarydetector, wherein the first and second reference interfaces aremechanically fixed with respect to each, and an electronic processorelectronically coupled to the primary and monitor detectors, theelectronic processor being configured to determine information about thetest object based on the second interference pattern and determining theinformation about the test object includes reducing uncertainty in theinformation about the test object due to vibrations in theinterferometry system based on information from the first interferencepattern. Embodiments of the interferometry systems can include featuresof other aspects.

In general, in a further aspect, the invention features methods thatinclude combining test light from a test object with primary referencelight from a first reference interface and secondary reference lightfrom a second reference interface to form a first interference patternon a monitor detector, combining test light with primary reference lightto form a second interference pattern on a primary detector, wherein thefirst and second reference interfaces are mechanically fixed withrespect to each, and determining information about the test object basedon the second interference pattern, wherein determining the informationabout the test object includes reducing uncertainty in the informationabout the test object due to vibrations in the interferometry systembased on information from the first interference pattern. Embodiments ofthe interferometry systems can include features of other aspects.

In general, in another aspect, the invention features apparatus thatinclude a microscope including an objective and a stage for positioninga test object relative to the objective, the stage being moveable withrespect to the objective, and a sensor system, that includes a sensorlight source, an interferometric sensor configured to receive light fromthe sensor light source, to introduce an optical path difference (OPD)between a first portion and a second portion of the light, the OPD beingrelated to a distance between the objective lens and the stage, and tocombine the first and second portions of the light to provide outputlight, a detector configured to detect the output light from theinterferometric sensor, a fiber waveguide configured to direct lightbetween the sensor light source, the interferometric sensor and thedetector, a tunable optical cavity in a path of the light from thesensor light source and the interferometric sensor, and an electroniccontroller in communication with the detector, the electronic controllerbeing configured to determine information related to the OPD based onthe detected output light.

Embodiments of the apparatus can include one or more of the followingfeatures and/or features of other aspects. For example, the electroniccontroller can be configured to adjust a focus of the microscope basedon the information. The microscope can be an interferometric microscope.The interferometric microscope can be a scanning white lightinterferometry (SWLI) microscope. The interferometric microscope is apupil plane SWLI microscope. The objective can be a Mirau objective, aLinnik objective, or a Michelson objective. The interferometricmicroscope can be configured to determine information about a testobject positioned on the stage by illuminating the test object with testlight and to combining the test light with reference light from areference object to form an interference pattern on a detector, whereinthe test light and reference light are derived from a common source, andthe apparatus can be configured to reduce uncertainty in the informationabout the test object due to scan errors based on the determinedinformation related to the sensor OPD.

In some embodiments, the sensor system includes one or more additionalinterferometric sensors each configured to receive light from the sensorlight source. Each interferometric sensor can be configured to introducean OPD between two components of its corresponding light, each OPD beingrelated to a corresponding displacement between the objective and thestage along a corresponding axis. The electronic controller can beconfigured to determine information about a tilt of the stage relativeto the objective based on determining information related to thecorresponding OPD for at least two of the interferometric sensors. Thesensor system can include one or more additional detectors, eachconfigured to receive output light from a corresponding interferometricsensor. Each additional interferometric sensor can receive light fromthe sensor light source and directs output light to its correspondingsensor through a corresponding fiber waveguide. The tunable opticalcavity can be in the path of the light from the sensor light source toeach interferometric sensor.

The interferometric sensor can include a lens positioned to receivelight exiting the fiber waveguide and to focus the light to a waist. Thelens can be a graded index lens. The lens can be attached to theobjective. Alternatively, the lens can be attached to the stage. In someembodiments, the fiber waveguide is a fiber with a thermally expandedcore.

The microscope can include a microscope light source and the objectivecomprises one or more optical elements, the microscope being configuredto deliver light from the microscope light source to the test object andthe one or more optical elements being configured to collect light fromthe test object, and the interferometric sensor can be configured todirect light to the stage through the one or more optical elements ofthe objective.

The sensor light source can be a broadband light source. The sensorlight source can have a peak intensity at a wavelength in a range from900 nm to 1,600 nm. The sensor light source can have a full-width athalf maximum of 50 nm or less. The sensor light source can have acoherence length of about 100 microns or less.

The tunable optical cavity can include two optical paths for the light,each path comprising a fiber stretcher module. The sensor light sourceand the detector can be located in a housing separate from themicroscope.

The information can be about a displacement between the objective lensand the stage along an axis. The microscope can be configured to scanthe stage parallel to the axis. The information can be about an absolutedisplacement between the objective lens and the stage. Alternatively,the information can be about a relative distance between the objectivelens and the stage.

The microscope can include a microscope light source and can beconfigured to deliver light from the microscope light source to a testobject located on the stage, wherein a wavelength of peak intensity ofthe microscope light source is about 100 nm or more from a wavelength ofpeak intensity of the sensor light source. The wavelength of peakintensity of the microscope light source can be in a range from 300 nmto 700 nm and the wavelength of peak intensity of the sensor lightsource is in a range from 900 nm to 1,600 nm.

In general, in a further aspect, the invention features apparatus thatincludes an imaging interferometer including one or more opticalelements and a stage for positioning a test object relative to the oneor more optical elements, the stage being moveable with respect to theone or more optical elements, and a sensor system that includes a sensorlight source, an interferometric sensor configured to receive light fromthe sensor light source, to introduce an optical path difference (OPD)between a first portion and a second portion of the light, the OPD beingrelated to a distance between the one or more optical elements and thestage, and to combine the first and second portions of the light toprovide output light, a detector configured to detect the output lightfrom the interferometric sensor, a fiber waveguide configured to directlight between the sensor light source, the interferometric sensor andthe detector, a tunable optical cavity in a path of the light from thesensor light source and the interferometric sensor, and an electroniccontroller in communication with the detector, the electronic controllerbeing configured to determine information related to the OPD based onthe detected output light.

Embodiments of the apparatus can include one or more of the followingfeatures and/or features of other aspects. For example, the imaginginterferometer can be an interferometric microscope. The imaginginterferometer can be a SWLI interferometer or a PUPS interferometer.

In general, in a further aspect, the invention features apparatus thatinclude an imaging interferometer comprising one or more opticalelements and a stage for positioning a test object relative to the oneor more optical elements, the stage being moveable with respect to theone or more optical elements, and a sensor system, that includes asensor light source, a plurality of interferometric sensors eachconfigured to receive light from the sensor light source, to introducean corresponding optical path difference (OPD) between a correspondingfirst portion and a corresponding second portion of the light, each OPDbeing related to a corresponding distance between the one or moreoptical elements and the stage, and to combine the corresponding firstand second portions of the light to provide corresponding output light,a plurality of detectors each configured to detect the output light froma corresponding interferometric sensor, a tunable optical cavity in apath of the light from the sensor light source to the interferometricsensors, and an electronic controller in communication with thedetectors, the electronic controller being configured to determineinformation related to the OPDs based on the detected output light fromeach interferometric sensor. Embodiments of the apparatus can includeone or more of the features of other aspects.

In general, in a further aspect, the invention features apparatus thatinclude a microscope including an objective and a stage for positioninga test object relative to the objective, the stage being moveable withrespect to the objective, and a sensor system, that includes a sensorlight source, a plurality of interferometric sensors each configured toreceive light from the sensor light source, to introduce ancorresponding optical path difference (OPD) between a correspondingfirst portion and a corresponding second portion of the light, each OPDbeing related to a corresponding distance between the objective lens andthe stage, and to combine the corresponding first and second portions ofthe light to provide corresponding output light, a plurality ofdetectors each configured to detect the output light from acorresponding interferometric sensor, a tunable optical cavity in a pathof the light from the sensor light source to the interferometricsensors, and an electronic controller in communication with thedetectors, the electronic controller being configured to determineinformation related to the OPDs based on the detected output light fromeach interferometric sensor. Embodiments of the apparatus can includeone or more of the features of other aspects.

In another aspect, the invention features systems that include theabove-mentioned apparatus including sensor systems, one or moreadditional microscopes each having a corresponding objective and acorresponding stage, where the sensor system includes one or moreadditional interferometric sensors each associated with one of the oneor more additional microscopes, each additional interferometric sensorbeing configured to receive light from the sensor light source.

Each of the one or more additional interferometric sensors can beconfigured to introduce an optical path difference (OPD) between a firstportion and a second portion of the light from the light source, the OPDbeing related to a distance between the objective lens and the stage ofthe microscope with which the sensor is associated, and to combine thefirst and second portions of the light to provide output light. Thesensor system can include one or more additional detectors, eachconfigured to detect the output light from a corresponding one of theadditional interferometric sensors. In embodiments, the sensor systemincludes one or more fiber waveguides configured to direct light betweenthe sensor light source and the one or more additional interferometricsensors.

Each of the microscopes can be arranged to inspect a different testobject (e.g., a different LCD panel substrate).

In general, in a further aspect, the invention features systems thatinclude a plurality of microscopes each having a corresponding objectiveand a corresponding stage for positioning a test object relative to theobjective, and a sensor sub-system including a sensor light source, oneor more fiber waveguides, and a plurality of interferometric sensors,the one or more fiber waveguides being configured to direct light fromthe sensor light source to the plurality of interferometric sensors,each interferometric sensor being associated with a correspondingmicroscope. The sensor sub-system further includes a plurality ofdetectors, each configured to received light from a correspondingsensor, and an electronic controller in communication with thedetectors. During operation, the sensor light source directs light viathe fiber waveguides to each of the sensors, and each sensor directsoutput light to its corresponding detector, the output light comprisingan interferometric phase related to a distance between the objective andstage of the microscope with which the sensor is associated, and theelectronic controller determines information related to a distancebetween the objective and stage based on the detected output light.

Embodiments of the system can include one or more of the featuresdiscussed above with respect to other aspects of the invention.

A number of documents are incorporated into this application byreference. In the event of conflict, the present application willcontrol.

The details of one or more embodiments are set forth in the accompanyingdrawings and the description below. Other features and advantages willbe apparent from the description and drawings, and from the claims.

DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic diagram of an embodiment of a low coherenceinterferometry system including an interference microscope.

FIG. 2 is a diagram of an interference pattern in a field of view of adetector.

FIG. 3 is a plot showing intensity versus OPD of a low coherenceinterferometry signal.

FIG. 4 is a plot showing intensity versus OPD for a monitor signal.

FIG. 5 is a plot of relative test object displacement as a function oftime during a scan showing the effect of scan errors.

FIG. 6 is a plot showing system sensitivity to scan error as a functionof vibrational frequency.

FIG. 7 is a schematic diagram of an embodiment of a low coherenceinterferometry system including an interference microscope.

FIG. 8 is a schematic diagram illustrating the relationship betweenlight in an image plane and a pupil plane.

FIG. 9 is a schematic diagram of an embodiment of a low coherenceinterferometry system including an interference microscope.

FIG. 10 is a schematic diagram of an embodiment of a low coherenceinterferometry system including an interference microscope.

FIG. 11 is a flow chart showing a J-matrix approach.

FIGS. 12A-B are flow charts showing J-matrix approaches.

FIGS. 13A-13E are plots from numerical experiments comparing a J-matrixapproach with a DFT approach.

FIGS. 14A-14E are plots from numerical experiments comparing a J-matrixapproach with a DFT approach.

FIGS. 15A-15E are plots from numerical experiments comparing a J-matrixapproach with a DFT approach.

FIGS. 16A-16B are plots from numerical experiments demonstrating aJ-matrix approach.

FIGS. 17A-17C are plots from numerical experiments demonstrating aJ-matrix approach.

FIG. 18 shows plots of interferometric signals from a numericalexperiment.

FIG. 19 is a schematic diagram of an embodiment of an interferometrysystem with a compound reference.

FIG. 20 is a simulated intensity reflectivity image based on a compoundreference only.

FIG. 21A shows a plot of the intensity reflectivity across the image ofFIG. 20.

FIG. 21B shows a plot of the phase variation across the image of FIG.20.

FIG. 22 is a simulated intensity reflectivity image based on a compoundreference and a test object detected with a monitor camera.

FIG. 23 is a simulated intensity reflectivity image based on a compoundreference and a test object detected with a primary camera.

FIG. 24A shows a plot of the intensity reflectivity across the image ofFIG. 22.

FIG. 24B shows a plot of the phase variation across the image of FIG.22.

FIG. 25A shows a plot of the intensity reflectivity across the image ofFIG. 23.

FIG. 25B shows a plot of the phase variation across the image of FIG.23.

FIG. 26 is a flowchart illustrating data processing for an interferencesystem with a compound surface.

FIG. 27 is a schematic diagram of an embodiment of an interferometrysystem with a compound reference.

FIG. 28 is a schematic diagram of an embodiment of the interferometrysystem of FIG. 8 including beam guiding optics.

FIG. 29 is a schematic diagram of an embodiment of an interferometrysystem with a compound reference.

FIG. 30 is a schematic diagram of an embodiment of an interferometrysystem with a compound reference.

FIG. 31 is a schematic diagram of an embodiment of an interferometrysystem with a compound reference.

FIG. 32 is a schematic diagram of an embodiment of a low coherenceinterferometry system including an interference microscope and a laserdisplacement interferometer.

FIG. 33A is a schematic diagram of an embodiment of a combined apparatuscomprising a sensor system and an interferometry system.

FIG. 33B is a schematic diagram of an embodiment of a sensor system,

FIG. 34 is a schematic diagram of an embodiment of a sensor.

FIG. 35 is a diagram of a reference cavity.

FIG. 36 is a flow chart of an operation of a combined apparatuscomprising a sensor system and an interferometry system.

FIG. 37 is a plot illustrating an autofocus mode of a combined apparatuscomprising a sensor system and an interferometry system.

FIG. 38 is a plot illustrating a motion monitoring mode of an combinedapparatus comprising a sensor system and an interferometry system.

FIG. 39 is a schematic diagram showing a combination of a Mirauobjective and two sensors.

FIG. 40 is a schematic diagram showing a combination of a Michelsonobjective and a sensor.

FIG. 41 is a schematic diagram showing a combination of a Linnikobjective and two sensors.

FIG. 42A is a schematic diagram showing a configuration of an objectivewith a sensor.

FIG. 42B is a schematic diagram showing a configuration of an objectivewith a sensor.

FIG. 42C is a schematic diagram showing a configuration of an objectivewith a sensor.

FIG. 43A is a schematic diagram showing a combination of a Michelsonobjective and a sensor.

FIG. 43B is a schematic diagram showing a combination of a Michelsonobjective and a sensor.

FIG. 43C is a schematic diagram showing a combination of a Linnikobjective and a sensor.

FIG. 43D is a schematic diagram showing a combination of a Linnikobjective and a sensor.

FIG. 44A is a schematic diagram showing a combination of a Michelsonobjective and a sensor.

FIG. 44B is a schematic diagram showing a combination of a Linnikobjective and a sensor.

FIG. 45A is a schematic diagram showing a combination of a Michelsonobjective and two sensors.

FIG. 45B is a schematic diagram showing a combination of a Linnikobjective and two sensors.

FIG. 45C is a schematic diagram showing a combination of a Linnikobjective and three sensors.

FIG. 46 is a schematic diagram showing a configuration of an objectiveand a scanner with a sensor.

FIG. 47 is a schematic diagram showing a configuration of an objectivewith a sensor and a separate reference minor.

FIG. 48A is a schematic diagram showing a configuration of a turretobjective with two sensors and two objectives.

FIG. 48B is a schematic diagram showing a turret objective with a sensorand two objectives.

FIG. 49A is a schematic showing a device exemplary of the film structureresulting from the deposition of a dielectric over copper featuresdeposited on a substrate.

FIG. 49B is a schematic diagram of the device shown in FIG. 49A afterundergoing chemical mechanical processing.

FIG. 50A is a schematic diagram showing a top down view of an objectthat includes a substrate, e.g., a wafer, and an overlying layer, e.g.,photoresist layer.

FIG. 50B is a schematic diagram showing a side on view of the object.

FIG. 51A is a schematic diagram of a structure suitable for use insolder bump processing.

FIG. 51B is a schematic diagram of the structure from FIG. 51A aftersolder bump processing has occurred.

FIG. 52A is a schematic diagram of an LCD panel composed of severallayers.

FIG. 52B is a flow chart showing various steps in LCD panel production.

FIG. 52C is a diagram of an embodiment inspection station for LCD panelsincluding an interferometric sensor.

FIG. 53 is a schematic diagram of a system including multiplemicroscopes and a sensor system.

Like reference symbols in the various drawings indicate like elements.

DETAILED DESCRIPTION

Referring to FIG. 1, a low coherence interferometry system 100 includesan interference microscope 110 arranged to study a test object 175.Interference microscope 110 is in communication with a general purposecomputer 192 that performs analysis of data signals from interferencemicroscope 110 to provide information about test object 175. A Cartesiancoordinate system is provided for reference.

Interference microscope 110 includes an interference objective 167 and abeam splitter 170 arranged to reflect illumination from a sourcesub-system in microscope 110 to test object 175 via interferenceobjective 167, and to transmit illumination reflected from test object175 to a detector sub-system for subsequent detection. Interferenceobjective 167 is a Mirau-type objective and includes an objective lens177, a beam splitter 179, and a reference surface 181.

The source sub-system includes a primary source 163, a secondary source197, and a beam combiner 164 arranged to combine light from primarysource 163 and secondary source 197 and direct the light to beamsplitter 170 via relay optics 169 and 171. As will be explained in moredetail below, primary source 163 provides low coherence light for thelow coherence interferometry measurements while secondary source 197provides light having a longer coherence length for monitoring thescan-history during a scan.

Primary source 163 is a spatially-extended broadband source providingillumination over a broad band of wavelengths (e.g., an emissionspectrum having a full-width, half-maximum of more than 50 nm, orpreferably, even more than 100 nm). For example, source 163 can be awhite light emitting diode (LED), a filament of a halogen bulb, an arclamp such as a Xenon arc lamp or a so-called supercontinuum source thatuses non-linear effects in optical materials to generate very broadsource spectra (e.g., having spectral FWHM of about 200 nm or more).

Secondary source 197 has a coherence length that is longer than thecoherence length of primary source 163. In some embodiments, secondarysource 197 is a highly coherent source, such as a single mode lasersource. Source 197 can be a monochromatic source.

The detector sub-system also includes an intensity monitor 161, coupledto primary source 163. Monitor 161 provides information about theintensity of primary source 163, allowing system 100 to account forfluctuations in this intensity.

The detector sub-system includes a primary detector 191, a secondarydetector 199, and a beam splitter 198 arranged to direct light frominterference objective 167 to the primary and secondary detectors.Primary detector 191 and secondary detector 199 are both multi-elementdetectors (e.g., multi-element CCD or CMOS detectors). Optionally, thedetector sub-system includes a bandpass filter 101 that filters thelight impinging on secondary detector 199, allowing only light fromsecondary source 197 to reach the secondary detector 199.

During operation of system 100, primary source 163 provides input light165 to interference objective 167 via relay optics 169 and 171 and beamsplitter 170. Light from secondary source 197 is combined with inputlight 165 by beam combiner 164. Objective 167 and relay optic 189 directlight 183, 187 reflected from test object 175 onto detector 191, formingan image of test object 175 in a field of view (FOV) at detector 191.Beam splitter 198 also directs a portion of the light from objective 167to secondary detector 199. Note that marginal rays are indicated by 183and chief rays are indicated by 187.

Beam splitter 179 directs a portion of the light (shown by rays 185) toreference surface 181, and recombines the light reflected from referencesurface 181 with light reflected from test object 185. At detector 191,the combined light reflected from test object 175 (referred to as testlight) and reference surface 181 (referred to as reference light) forman optical interference pattern on detector 191. Because interferencemicroscope 100 is configured for conventional imaging, the opticalinterference pattern (also referred to as an interferogram orinterference image) corresponds to an image of the test surface.

Interference microscope 110 also includes an actuator 193 that controlsthe position of interference objective 167 relative to test object 175.For example, actuator 193 can be a piezoelectric transducer coupled tointerference objective 167 to adjust the distance between test object175 and interference objective 167 in the Z-direction. This type ofrelative motion between test object 175 and interference objective 167is referred to as focus scanning because it scans the position of thefocal plane of interference objective 167 relative to test object 175.

During operation, actuator 193 scans interference objective 167 relativeto test object 175, thereby varying the OPD between the test light andreference light producing an interferometry signal at each of thedetector elements. Actuator 193 is connected to computer 192 via aconnection line 195 through which computer 192 can control, for example,the scan-velocity during data acquisition. In addition, oralternatively, actuator 193 can provide information about thescan-motion, such as an intended scan-increment to computer 192.

FIG. 2 shows an exemplary optical interference pattern at detector 191for a single scan position, showing interference fringes related tosurface-height modulations of the test object in the X- andY-directions. Intensity values of the optical interference patternacross detector 191 are measured by different elements of detector 191and provided to an electronic processor of computer 192 for analysis.Each detector element acquires intensity data at a frame rate (e.g.,about 30 Hz or more, about 50 Hz or more, about 100 Hz or more), whichis typically constant during the scan. The intensity values measuredwith a detector element and associated with a sequence of OPD valuesbetween the test and reference light form the low coherenceinterferometry signal.

FIG. 3 shows a plot of detected intensity, I_(i), as a function of scanposition for a single element of detector 191. The plot shows a typicallow coherence interference signal with sinusoidal interference fringesmodulated by a Gaussian envelope at the position of zero OPD between thetest and reference light. The width of the Gaussian envelope depends onthe coherence length of primary source 163. The OPD scan is longer thanthe coherence length of the source.

While primary detector 191 acquires low coherence interference signals,secondary detector 199 acquires interference signals based on thecoherent light from secondary source 197. FIG. 4 shows a plot of such aninterference signal for a single pixel of the secondary detector 199 asa function of the scan-position Z. The interference signals acquiredusing secondary detector 199 are referred to as monitor signals.

Typically, the OPD is scanned at a constant velocity and data points areacquired at even time intervals. In principle, each data point isacquired at even displacement increments in the OPD. However, eventhough the scan is usually assumed to be of constant velocity, the scanmotion often deviates from a linear movement due to mechanicalimperfections or the movement disturbing vibrations, for example. Thus,the acquired interferometric data can include errors related to thenon-uniformity of the scan, which cause deviations of the actualscan-position from a nominal scan-position to which the measuredintensity values are associated.

Such errors are referred to as “scan errors,” which are illustratedgraphically in FIG. 5. This figure shows a plot of z as a function oftime, where z is the relative displacement between test object 175 andobjective 167. Essentially, z corresponds to the OPD between the testand reference light. The plot shows a line representing a constantvelocity scan. Four acquisition times are shown (t₁-t₄). In the absenceof scan errors, the position, z, of the test object would lie on theline. However, scan errors cause a deviation between this nominalposition and the actual position of the test object at the acquisitiontime, hence the actual positions of the test object, shown in the plotas the data points, deviate from the line. The magnitude of the scanerror at each acquisition time is shown as ε_(i) where i=1 . . . 4.

In general, the sensitivity of measurements made using system 100 toscan errors varies depending on the frequency of the scan error source.For example, system sensitivity can vary depending on the frequency ofvibrations experienced by the system. As an example, in FIG. 6, therelative sensitivity S_(v) to vibrations is plotted as a function ofvibration frequency f_(vib) for a low coherence system operating with amean wavelength of 570 nm, a full-width at half maximum spectralbandwidth of 200 nm, a low NA objective, a sampling scan-interval of71.5 nm, and a primary detector with a 100 Hz frame rate. Sensitivity islow for frequencies from 20-30 Hz and 70-80 Hz, with peaks of relativelyhigh sensitivity between those frequency bands. An exemplary fringecarrier frequency is approximately 25 Hz for SWLI and the primarydetector therefore samples approximately four times for each fringe. Itis believed that the high sensitivity region for frequencies <25 Hzshown in FIG. 6 can be related to errors in the scan-speed, while thehigh sensitivity regions for frequencies >25 Hz may be related todistortions in the scan-increment due to vibrations. The distortion maybe rapidly changing in sign for the data acquisition for neighboringscan-position, e.g., from recorded camera frame to camera frame. Ingeneral, as used herein, “low frequency” scan error sources (e.g., lowfrequency vibrations) refer to frequencies equal to or less than theframe rate of the detector used to acquire the low coherenceinterference signals (e.g., primary detector 191). “High frequency” scanerror sources (e.g., high frequency vibrations) refer to frequenciesgreater than the frame rate of the detector used to acquire the lowcoherence interference signals.

To reduce the effects of scan errors in measurements made using system100, computer 192 uses information from the monitor signals acquiredusing secondary detector 199 to reduce the effect of scan errors in thelow coherence signals acquired using primary detector 191. As themonitor signals are based on a coherent light source (secondary source197), the fringes extend over the length of the scan and theinterpretation providing phase information (and correspondingly relativedisplacement information) over the entire scan range. As will bediscussed below, in general, the analysis of monitor signals formultiple points in the FOV of secondary detector 199 allows determiningthe scan errors, including those caused by vibration, specifically inthe high frequency region as defined above.

Assuming that the phases of the scanned monitor signals show somedifferences over the FOV, this diversity of phases (i.e., differingphase offsets of at least some of the monitor signals) allows for thecorrection of systematic errors in the interpretation for scan errorsthat may be changing rapidly from scan-position to scan-position. Thus,when appropriately analyzed, this feature enables one to accuratelymeasure high frequency vibrations that would be incorrectly measured inthe absence of multiple measurements providing the phase diversity.Providing a large selection of image points for the monitor signalsaccommodates also highly-patterned object surfaces, such assemiconductor wafers.

Thus, once computer 192 has determined the scan-motion history, forexample, the true (or at least more correct) scan-motion can bedetermined for the low coherence signals based on the interpretation ofthe monitor signals. Further processing of the low coherence datacollected by primary detector 191 (e.g., by means of a cubic splineinterpolation or other algorithm) reduces the effect of scan errors onthis data. Data analysis of both the monitor signal data and the lowcoherence signal data are described in more detail below.

PUPS Interferometry Systems

While the foregoing discussion is with respect to an interferencemicroscope configured to image the test object to the detector, scanerror correction can also be applied to other configurations. Forexample, in some embodiments, interference microscopes can be configuredto image a pupil plane of the microscope to the detector. Suchconfigurations are referred to as PUPS configurations. This mode ofoperation can be useful, for example, for determining the complexreflectivity of the test surface.

FIG. 7 illustrates a PUPS interferometry system 200 incorporating anumber of elements previously described in connection with system 100shown in FIG. 1. However, unlike system 100, system 200 includes apupil-plane imaging tube lens 213 and a polarizer 215 positioned betweenobjective lens 167 and beam splitter 170. In system 200, a pupil plane217 is imaged onto detector 191. A field stop 219 restricts the sampleillumination to a small area on test object 175. System 100 acquiresdata in the same manner as system 100, described above.

For analysis, electronic processor 192 transforms the interferometrysignals from primary detector 191 into a frequency domain and extractsthe phase and amplitude information for the different wavelengthcomponents of primary light source 163. As the source spectrum can bebroad, many independent spectral components can be calculated. Theamplitude and phase data can be related directly to the complexreflectivity of the test surface, which can be analyzed to determineinformation about the test object.

Because of the arrangement of system 200, each detector element ofprimary detector 191 provides measurements at a multiplicity ofwavelengths for a specific angle of incidence and polarization state(according to the polarizer 215). The collection of detector elementsthus covers a range of angles of incidence, polarization states andwavelengths.

FIG. 8 illustrates the relationship between light at a focus plane 229(e.g., at the test object) and at pupil plane 217. Because each sourcepoint illuminating pupil plane 217 creates a plane wave front for testlight illuminating the test object, the radial location of the sourcepoint in pupil plane 217 defines the angle of incidence of thisillumination bundle with respect to the object normal. Thus, all sourcepoints located at a given distance r from the optical axis of correspondto a fixed angle of incidence θ, by which an objective lens focuses thetest light to the test object. For a pupil-plane imaging tube lens withnumerical aperture NA and maximal radial distance r_(max) fortransmitted light, the relation between a point in pupil plane 217 atthe distance r from optical axis OA and the angle of incidence θ in thefocus plane 229 is given by sin(θ)=(r/r_(max))NA.

Path-Length Scanning

The foregoing embodiments, described in connection with FIGS. 1 and 6,both utilize Mirau objectives that provide focus scanning. In general,however, other configurations are also possible. For example,interferometry systems that include Linnik objectives can be used. Sucha system is shown in FIG. 9. Specifically, system 300 includes aninterference microscope 310 arranged to image test object 175 onto thedetector. System 300 includes a number of elements previously describedin connection with system 100 above. However, rather than a Mirauobjective, system 300 includes a Linnik interference objective 325,which features a beam splitter 379 that splits light from beam splitter170 into test light and reference light along different arms of theobjective. Objective 325 includes a test objective 327 in the arm of thetest light and a corresponding reference objective 329 in the referencelight arm. A reference object 381 is positioned in the reference arm andreflects the reference light back to beam splitter 379.

Reference objective 329 and reference object 381 are mounted in anassembly that is coupled to the other components of objective 325 via anactuator 331. During operation, actuator 331 adjusts the OPD between thetest light and reference light by moving the reference objective 329 andreference surface 381 relative to beam splitter 379. The path lengthbetween reference objective 329 and reference surface 381 remainsconstant during the scan. Accordingly, the OPD between the test andreference light is changed independently of the object focus. This typeof scanning is referred to herein as “path-length” scanning. In system300, path-length scanning increases the length of the collimated spacein the reference leg of the Linnik configuration whereas in the test legthe object stays at the same focus position during the scan.

Interferometry systems that feature Linnik objectives can also beconfigured for PUPS mode operation. Referring to FIG. 10, for example, asystem 400 includes an interference microscope 410 that includes Linnikobjective 325 and, like system 200 described above, is configured toimage a pupil plane onto primary detector 191.

In general, when correcting for scan errors, scan motion analysis shouldbe based on the scanning mode (e.g., focus or path-length scanning) andimaging mode (e.g., object imaging or PUPS) of the interferometrysystem. For example, carrier fringe frequency in low coherence signalscan vary depending on the system's mode of operation. For a Linnikinterferometer system operated in the PUPS mode, for example,path-length scanning causes the same fringe carrier frequency for allposition in the pupil plane image. Whereas, for a Mirau interferometeroperated in the PUPS mode, focus scanning (scanning the object focussimultaneously with the OPD) causes the fringe carrier frequency to falloff as the distance from the optical axis in the pupil plane increasesin proportion to cos(θ), where θ is the angle a ray makes with theoptical axis at the object plane (see FIG. 8).

Note that while the path-length scanning in the Linnik case generallycreates a constant frequency monitor signal across the pupil, there canbe two types of perturbations of the interferometric cavity. One type isvibration are unwanted scan motions (e.g., non-linearity) that occur onthe reference leg as objective 329 and reference minor 381 move as aunit. In this case the scan errors create optical path variations in themonitor signal that are independent of the position where the monitorsignal is measured in the pupil. The other type is vibration that takesplace in the object leg, resulting in variations of the distance betweenlens 127 and object surface 175. In this case the vibration introducesoptical path variations in the monitor signal that are function of theangle of incidence in object space (or equivalently that are function ofthe radial position at the pupil). It is necessary in such aconfiguration to separate these two motion components to properlyaccount for them in the subsequent signal correction.

In certain embodiments, a variation in fringe carrier frequency can beused in cases where the phase diversity of the multiple monitor signalsacross the FOV in PUPS mode at zero OPD is small. The variation infringe carrier frequency with radial position generates a diversity ofphases across the pupil FOV on either side of zero OPD, providing thenecessary information to accurately determine scan increments over lowand high vibration frequencies.

In general, the scan error correction techniques discussed herein arecompatible with both scanning methods and with both conventional andpupil plane imaging, with some differences in the data processing,particularly in the PUPS mode. If scanning in path length as in aLinnik-objective microscope adapted for PUPS measurements (see, e.g.,FIG. 10), the fringe carrier frequency is the same for all pixels in thepupil image. If scanning the object focus simultaneously with the OPD asin the Mirau-objective microscope of FIG. 7, then the fringe carrierfrequency falls off as the distance from the optical axis in the pupilplane increases in proportion to cos(θ), where θ is the angle the raymakes with the optical axis at the object plane. This variation infrequency can be advantageous in cases where the phase diversity acrossthe FOV in PUPS mode at zero OPD is small. The variation in frequencywith radial position generates a diversity of phases across the pupilFOV on either side of zero OPD, providing the necessary information toaccurately determine scan increments over all vibrational frequencies.

Determining Scan Positions from Monitor Data

In general, a variety of methods are available for determining the scanpositions from the monitor data. For example, if one restricts theanalysis to low-frequency sources of scan errors, it is sufficient toapply conventional phase-shifting interferometry (PSI) algorithms toestimate the phase of the monitor signals at a specific camera frame anda specific pixel. For example, if a nominal phase shift between cameraframes is π/2, a well-known phase shift algorithm has the form

$\begin{matrix}{{\tan \left\lbrack {\Phi (r)} \right\rbrack} = {\frac{2\left( {g_{2} - g_{4}} \right)}{{- \left( {g_{1} + g_{5}} \right)} + {2g_{3}}}.}} & (1)\end{matrix}$

Here, r is a vector specifying the pixel location, and g_(1, 2, . . . 5)are corresponding intensity measurements at that pixel for a sequence ofcamera frames acquired during the data-acquisition scan (see, e.g.,Schwider, et al., 1983; Encyclopedia of Optics, p. 2101, Table 2). Eq.(1) provides, in principle, the phase Φ at the mid frame g₃. As anotherexample, PSI algorithms can be applied to determine scan positionsproposed by Deck (L. Deck, “Vibration-resistant phase-shiftinginterferometry,” Appl. Opt. 35, 6655-6662 (1996)) and by Olszak andSchmit (U.S. Pat. No. 6,624,894). However, the PSI algorithm method iseffective for low-frequency vibrations only; because the algorithm isitself sensitive to high-frequency vibrations in the same way as the lowcoherence signal.

To compensate high-frequency vibrations as well as for thelow-frequencies, methods are used that measure the phase Φ(r) at aminimum of two different pixel locations. For example, in the specificcase of the use of a PSI algorithm (e.g., as shown in Eq. (1) orsimilar), it is believed that errors in determining Φ(r) are cyclic attwice the frequency of Φ(r). Accordingly, averaging measurements of twoor more phases in quadrature (different by90°) can cancel errors relatedto high-frequency vibrations.

More generally, several methods have been developed in the context ofPSI for determining the actual scan positions a posteriori frominterference data. In general, these methods are most effective if thereis a range of phases Φ(r) and/or frequencies to work with, which can beprovided, for example, by using a multi-element detector to acquire themonitor signals (e.g., as described in the embodiments above) along witha feature that introduces some phase diversity (where all monitorfrequencies have the same frequency) in the interferogram across the FOVof the multi-element detector.

Phase diversity can be introduced, for example, by the natural heightvariation of the test object when the system is operated in conventionalimaging mode. As another example, phase diversity can be introduced byin conventional imaging mode by tilting the test object or referenceobject to introduce interference fringes. In PUPS mode, in systems usinga Mirau objective or similar, the system geometry naturally introduces arange of interference-fringe frequencies across the FOV of the detector.

The following discussion provides an exemplary method of determiningscan positions using a range of phases Φ(r). Considering first aPUPS-Linnik system (e.g., as shown in FIG. 10), in which the referenceminor and objective lens are moved together as a rigid object along theoptical axis to achieve a path-length scan, the path difference forspecular reflection at different points in the pupil plane as z(t, r)where t denotes the time parameter during the scanning procedure. Thispath difference will consist of a perfect scan plus an error term:

z(t,r)=z ₀(t,r)+ε(t,r)  (2)

where z₀ denotes the ideal scan and ε denotes the error or noise term.The phase of the interferometer will be given by

Φ(t,r)=Φ₀(r)+2πz(t,r)/λ  (3)

where Φ₀ is a phase offset giving different points in the pixel plane apotential phase difference. The wavelength of the light from thesecondary source is given by λ, and it is assumed to be independent ofr.

Choosing the origin for r to be the point corresponding to the opticalaxis in the pupil plane, and letting θ(r) denote the angle of incidenceat the object focus plane of the specular ray passing through r in thepupil plane, it follows from the Abbé sine condition that

sin [θ(r)]=κ|r| for some constant κ  (4)

The scan of path difference will not depend on θ when the object andreference mirror move together as in a Linnik system, thus achieving ascan in the collimated space. But when the object focus is being scannedas in a Mirau system, the OPD depends on θ. Accordingly, one has twolimiting cases

z ₀(t,r)=z ₀(t), independent of r if pathlength is scanned

z ₀(t,r)=cos(θ(r))z ₀(t,0), if the focus is scanned  (5)

If both the path length and focus were scanned (which is possible in aLinnik system, for example), then z₀ would be a linear sum of these twotypes of motion.

As discussed above, in some embodiments, the scan is nominally aperfectly linear function of t, all the points of the pupil plane havethe same nominal OPD at the start of the scan, and there is ideally notilting of the object or reference as the scan progresses. In this case,one can write

z ₀(t,0)=c+ż ₀ t  (6)

Where c is a constant that may vary from scan to scan and where Ż₀ isalso a constant. The scan as a function of r will then depend on thetype of scan (Eq. (5)).

In general the error term ∈ can depend on both t and r, but since theobject is assumed to be a rigid body without any rotation as it scans,the error can be represented more simply as

ε(t,r)=ε_(p)(t)+cos(θ(r))ε_(f)(t).  (7)

The first sum in this expression represents vibration or scan error inthe collimated space, and the second term proportional to cos(θ)represents vibration or scan error in the high numerical aperture spaceof the interferometer caused by focus error. The assumption is that ε issmall.

The monitor signal interference intensity that is detected at the pupilplane by the secondary detector is time dependent, and it depends on thephase difference in the interferometer as given by the following formula

I(t,r)=[A(r)+dA(t,r)] cos [Φ(t,r)]+c(r)+dc(t,r)  (8)

A(r) denotes the mean amplitude of the interferogram at the point r.dA(t, r) denotes the fluctuations about the mean of the interferogram'samplitude at the point r. Φ(t, r) denotes the phase at r as a functionof time t. c(r) denotes a mean offset for the interferogram signal whichis in general r dependent. dc(t,r) denotes a fluctuation about the meanof the offset. This is typically a slowly varying function of time.

The intensity I(t, r) is sampled at a discrete set of times {t_(i)} anda discrete set of points in the pupil plane {r_(i)}. The ideal-timesample points are assumed to be equally spaced so that

t _(i+1) =t _(i) +δt, where δt is independent of i.  (9)

For a point r the full set of times {t_(i)} can be thought of as a onedimensional array, and an estimate can be made of the noise termsε_(p)(t) and ε_(f)(t). A single pixel does not give a reliable estimateof these error terms at high vibrational frequencies, as noted above.But with a multiplicity of such vectors at different points {r_(i)}, alarge number of estimates can be made for each of these noise terms. Thefinal estimates are obtained by applying a median to the set ofmeasurements

ε_(p)(t)=median(ε_(p) ^(i)(t))

ε_(f)(t)=median(ε_(f) ^(i)(t))  (10)

where here i denotes the estimate made using the vector taken atdifferent times for the point r_(i). The choice of which points {r_(i)}to use is somewhat arbitrary, the main consideration being that thepoints should have as much variance in the starting phase as possible,or if focus scanning is being used, that it have several θ values.

The following algorithm acts on a single vector set {t_(i)}. The firststep is to calculate precisely the peaks of the vector I(t_(i), r). Thisrequires that that δt be small enough so that the number of samples in asingle sine wave of interference signal data be in the range 8 to 30samples per wave. With this fine sampling, an interpolation of thesampled points can be made using, for example, a cubic spline

I _(Fine)=spline(z,I,z _(fine))  (11)

From the vector I_(Fine) one can calculate the extrema of the signal(both maxima and minima) which occur at phases which are odd multiplesof π/2.

peaks=peakfinder(I _(Fine))  (12)

Using these peak values we can estimate all of the following quantities:c(t)+dc(t), A+dA(t), and the ideal phase Φ_(ideal) as a function of t.One finds Φ_(ideal) by fitting the following functional form to the peakdata:

Φ_(Ideal)(t _(i) ,r)=Φ_(Ideal)(t ₀ ,r)+(i−1)ΔΦ_(Ideal)(r)  (13)

where

ΔΦ_(Ideal)(r)=2πż ₀/λ for pathlength scanning

ΔΦ_(Ideal)(r)=2π cos(θ(r))ż ₀/λ for focus scanning  (14)

The fitting task amounts to finding the best values of the startingphases Φ_(ideal)(t₀, r) to make the peaks of the cosine function occurwhere the observed peaks were found. If the value for ż₀ is not knownprecisely, then it too can be part of the data-fitting algorithm.

Other methods of fitting the monitor signals are also possible. Forexample, an alternative to peak finding is an FFT means to estimate thephase. However, an advantage of using peaks is that it does not requirethat the sample period divide evenly into the whole scan length, whichmay be an advantage when scanning the focus plane because the sampleperiod would vary from ring to ring in the pupil plane for a PUPSanalysis.

The next task is to estimate the error in Φ caused by inaccuratescanning. This can be done, for example, with an arc cosine function asfollows (which it to be understood as returning a value between 0 and π)

dΦ=Φ−Φ _(ideal)=sign(sinΦ_(Ideal))*(cos⁻¹((I−c−dc)/(A+dA))−Φ_(Ideal)  (15)

This formula should be applied to all the sample points of the vector.Once dΦ is estimated, it is a simple matter to calculate the error ε(t,r). Processing a plurality of such vectors for different values of θprovides sufficient information to separate the error terms ε_(p)(t) andε_(f)(t). For instance, if n monitor signals are analyzed at differentangles of incidence the collected information yields n equations foreach time sample t:

ε₁(t)=ε_(p)(t)+cos(θ₁)ε_(f)(t)

M

ε_(n)(t)=ε_(p)(t)+cos(θ_(n))ε_(f)(t)

This provides an overdetermined system of equations that is readilysolved to provide estimates for both ε_(p)(t) and ε_(f)(t). Thisprocedure is required for example in the case of a path-length scan inthe Linnik geometry where vibration is possible in both the referenceand object legs. For a Linnik or Mirau interferometer where focus-scanis used the math above simplifies to:

ε₁(t)=cos(θ₁)ε_(f)(t)

M

ε_(n)(t)=cos(θ_(n))ε_(f)(t)

in which case one can simply compute the median value of the resulting nestimates of ε_(f)(t).

Correction of the Low-Coherence Signal Data

In general, once the scan errors are known, the low coherenceinterferometry data can be corrected to account for the errors. Thefollowing is a more a detailed example to illustrate correction of thelow coherence signal itself prior to any further processing. Once thescan positions have been measured, the low coherence scan data can becorrected by means of cubic interpolation or other types ofinterpolation formula. Let I_(w) (t, r) denote the low coherence scandata. It is known from the scan error analysis that this data was notsampled at the times {t_(i)}, but rather was sampled at these times plusan error term. So the actual samples occurred at times

$\begin{matrix}{{{T_{i}(r)} = {t_{i} + {\Delta_{i}(r)}}}{where}} & (16) \\{{{\Delta_{i}(r)} = {\left\lbrack {{e_{p}\left( t_{i} \right)} + {{\cos \left( {\theta (r)} \right)}{e_{f}\left( t_{i} \right)}}} \right\rbrack/\frac{{z_{ideal}(r)}}{t}}}{Where}} & (17) \\{{\frac{{z_{ideal}(r)}}{t} = {{\overset{.}{z}}_{0}\mspace{14mu} {for}\mspace{14mu} {pathlength}\mspace{14mu} {scanning}}}{\frac{{z_{ideal}(r)}}{t} = {{\cos \left( {\theta (r)} \right)}{\overset{.}{z}}_{0}\mspace{14mu} {for}\mspace{14mu} {object}\mspace{14mu} {focus}\mspace{14mu} {scanning}}}} & (18)\end{matrix}$

So, we have measured the values I_(w)(T_(i),r), but we desired tomeasure I_(w)(t_(i),r), and so we can use cubic spline interpolation tocalculate I_(w)(t_(i),r) approximately by using the formula

I _(w)(t _(i) ,r)=I _(w)(T _(i)−Δ_(i)(r),r)  (19)

To perform the cubic spline, a table of points [T_(i),I_(i)] isestablished for i=0, 1, 2, . . . , n for the function I=I(t). That makesn+1 points and n intervals between them. The cubic spline interpolationis typically a piecewise continuous curve, passing through each of thevalues in the table. There is a separate cubic polynomial for eachinterval, each with its own coefficients:

S _(i)(t)=a _(i)(t−T _(i))³ +b _(i)(t−T _(i))² +c _(i)(t−T _(i))+d _(i)for t∈[T_(i),T_(i+1)]  (20)

together, these polynomial segments are denoted S(t), the spline.

Since there are n intervals and four coefficients for each a total of 4nparameters are needed to define the spline S(t). 4n independentconditions are needed to fix them. Two conditions can be obtained foreach interval from the requirement that the cubic polynomial match thevalues of the table at both ends of the interval:

S _(i)(T _(i))=I _(i) S _(i)(T _(i+1))=I _(i+1)  (21)

Notice that these conditions result in a piecewise continuous function.2n more conditions are still needed. Since it is desirable to make theinterpolation as smooth as possible, one can require that the first andsecond derivatives also be continuous:

S′ _(i−1)(T _(i))=S′ _(i)(T _(i)), S″ _(i−1)(T _(i))=S″ _(i)(T_(i))  (22)

These conditions apply for i=1, 2, . . . , n−1, resulting in 2n−1constraints. Accordingly, two more conditions are needed to completelyfix the spline. There are some standard choices left to the user:

S″ ₀(T ₀)=0, S″ _(n−1)(T _(n))=0, called “natural”  (23)

S′ ₀(T ₀)=I′ ₀ , S′ _(n−1)(T _(n))=I′ _(n), called “clamped”  (24)

Other choices are possible if the function is periodic. Which is bestdepends on the application.

With 4n coefficients and 4n linear conditions it is straightforward towork out the equations that determine them using, for example,conventional algorithms.

The low coherence interference signal corrected in this way may then beprocessed according to the application, be it PUPS analysis of surfacestructure or conventional surface topography measurements.

J-Matrix Approach

In some embodiments, an approach referred to as the “J-matrix” approachcan be used to correct interferometry data using scan error informationfrom monitor signals. This approach is described below.

In a scan-error free measurement that provides absolutely evenly spacedsamples of a signal, the resulting undisturbed signal can be representedby an M element vector a, which can be spectrally analyzed by performinga discrete Fourier transform (DFT). The DFT is mathematically equivalentto solving a linear equation system in the matrix form

F·{right arrow over (s)}={right arrow over (u)},  (25)

where the columns of the M×M matrix F are basis functions representingpurely oscillatory signals and the signal u is interpreted as a linearcombination of those basis functions. In a complex notation the elementsof matrix F are

$\begin{matrix}{F_{m,n} = {\frac{1}{M}{^{2{{\pi } \cdot {({m - 1})} \cdot {({n - 1})} \cdot \frac{1}{M}}}.}}} & (26)\end{matrix}$

The equation system is solved for the spectral coefficients contained invector {right arrow over (s)}:

{right arrow over (s)}=F ⁻¹ ·{right arrow over (u)}  (27)

F⁻¹ turns out to be

$\begin{matrix}{\left( F^{- 1} \right)_{m,n} = ^{2{{\pi } \cdot {({m - 1})} \cdot {({n - 1})} \cdot \frac{1}{M}}}} & (28)\end{matrix}$

so that the m^(th) element of vector {right arrow over (s)} becomes

$\begin{matrix}{{s_{m} = {\sum\limits_{n = 0}^{M - 1}{{\overset{\rightarrow}{u}}_{n} \cdot ^{2{{\pi } \cdot {({m - 1})} \cdot {({n - 1})} \cdot \frac{1}{M}}}}}},} & (28)\end{matrix}$

which has the form of a conventional definition of a discrete Fouriertransformation (apart from the index shift which is a consequence offact that the indices start at 1, not 0). The M elements of vector{right arrow over (s)} denote the frequency content of the 0^(th),1^(st), . . . , (M−1)^(st) harmonic in the undisturbed signal {rightarrow over (u)}. Note that the (M−h)^(th) harmonic is equivalent to the−h^(th) harmonic. That means that the spectral components at the upperend of the spectrum are actually negative frequency components.

Now consider a signal taken at uneven sampling increments, such asnominally even sampling increments compromised by scan errors (e.g., dueto vibration in the measurement system) or missing data points. Thespectral analysis of the disturbed signal {right arrow over (d)} bymeans of a regular DFT would inevitably result in a disturbed spectrum.

The Lomb-Scargle method is one way to perform a spectral analysis ofunevenly spaced data if the sampling increments are known. In general,the Lomb-Scargle method represents a least-squares fitting of sinecurves to the data. A power spectrum estimate is calculated for eachfrequency of interest independently. The fact that the fitting functionsare not orthogonal to each other can lead to some leakage betweendifferent frequency components. The method is therefore generally not anexact method but is nevertheless a very powerful method in the presenceof high noise levels.

In certain embodiments, one can take an approach for the spectralanalysis of unevenly spaced data that is closer to a DFT. In general, incontrast to the way the DFT was set up above, a modified set of basisfunctions is used to form a new M×M matrix J. Each basis function(matrix column) contains the values of a pure oscillatory signal sampledat the known sampling positions. As in the DFT case, the aim is toconstruct the measured signal as a linear combination of the basisfunctions. The elements of the new matrix are

J _(m,n) =c·e ^(2πi·X) ^(m) ^(·Y) ^(n) .  (29)

The function X_(m) holds the information about the unevenly sampled scanpositions. In an OPD scan of an interferometer, for example, X_(m) canrepresent the M scan positions at which data were taken (e.g.,

${X_{m} = \frac{z_{m}}{{nominal}\mspace{14mu} {scan}\mspace{14mu} {increment}}},$

where z_(m) are the actual physical scan positions, taking into accountthe angular dependence shown in Eq. (7)). In general, a variety oftechniques can be used to acquire values for X_(m) such as, for example,the techniques discussed above. Additional techniques are discussedbelow

The function Y_(n) defines what the frequencies of interest are. For anapplication where the frequency analysis substitutes a DFT, the functionY_(n) becomes, for example,

$\begin{matrix}{Y_{n} = \left\{ \begin{matrix}{{\left( {n - 1} \right) \cdot \frac{1}{M}},} & {{{for}\mspace{14mu} \left( {n - 1} \right)} \leq \frac{M}{2}} \\{{\left( {n - 1 - M} \right) \cdot \frac{1}{M}},} & {{{for}\mspace{14mu} \left( {n - 1} \right)} > \frac{M}{2}}\end{matrix} \right.} & (30)\end{matrix}$

and thereby represents positive and negative frequencies ranging from 0to an equivalent of M/2 periods within the scan. The upper frequencylimit, known as the Nyquist frequency, is a general limit of the DFT,whereas the method using the J-matrix can in special cases be composedto analyze frequencies beyond that limit, as shown in the numericalexamples discussed below. The constant c is a factor that can be chosento be 1 or 1/M if a definition closer to a DFT is desired.

The new linear equation system in matrix form

J·{right arrow over (s)}={right arrow over (d)}  (31)

is solved for the spectral components in vector _(t):

{right arrow over (s)}=J ⁻¹ ·{right arrow over (d)}.  (32)

Provided that all data points in vector {right arrow over (d)} areindependent (the M values in X_(m) are unique), this method results inan exact solution.

It should be noted that the set of basis functions in matrix J isgenerally not orthogonal. For an exact solution, however, linearindependence of the basis functions is sufficient.

In applications like low coherence interferometry, where typically alarge amount of data sets (e.g., one for each camera pixel) need to bespectrally analyzed, the same J-matrix inverse J ⁻¹ can be applied toall data sets because the uneven OPD sampling is the same for all thepixels. This makes the method reasonably fast because calculations arelimited to one matrix inversion and P multiplications of a matrix with avector, where P is the number of camera pixels.

As discussed previously, actual measurement systems are not only exposedto scan errors caused, for example, by vibration, but also measurementnoise that adds an unknown value to one or more recorded data points(e.g., shot noise or digitization errors in the camera of aninterferometer).

In general, the accuracy of a spectral analysis using the J-matrix canbe affected by a number of factors. For example the degree to which theresult of the spectral analysis using the J-matrix is affected by thenoise depends on both the signal-to-noise ratio and the condition of theJ-matrix and its inverse.

Generally, extremely uneven scan increments with nearly-identical valuesof X_(m) for different m lead to barely-independent basis functions andbadly-conditioned matrices and therefore instable solutions of thecalculated spectrum in the presence of noise.

It is believed that in the case of stability problems due to noise, ahigher degree of stability can be achieved by limiting the spectralanalysis to a frequency band in which a spectrum magnitude greater thanzero is expected. The J-matrix then becomes rectangular (less columnsthan rows). Consequently, the linear equation system is over-determined.An optimal solution in the least-square sense is calculated. Since theinverse of a rectangular matrix does not exist, a pseudo-inverse of thematrix should be calculated, which can be done using, for example,singular value decomposition (SVD) or the Moore-Penrose inverse of theform

J ⁻¹=(J ^(T) J)⁻¹ J ^(T),  (33)

where the superscripted T denotes the transpose of a matrix. Apart frombeing more stable, the approach with a rectangular J-matrix has thefurther advantage of being faster, especially if the inverse matrix hasto be multiplied to many data vectors.

The formalism, now being able to spectrally analyze data that was takenat uneven sampling positions, can be extended to also compensate formore general signal distortions. These additional distortions can be afunction of the camera frame m (such as a fluctuating light source in aninterferometric application), a function of the frequency component n(such as spectrally filtering effects of elements in the measurementsetup) or a combination thereof (such as a spectrally fluctuating lightsource). These effects are combined in the function I_(m,n). Monitoringthis function requires independent metrology. Potentially, the functionI_(m,n) and the function X_(m) containing the information about thesampling positions can be measured at higher rates than the disturbedsignal {right arrow over (d)} (data that has to be spectrally analyzed).The J matrix elements then become a weighted average of terms of theform shown on the right hand side of Eq. 29. Here S is the number ofvalues for I and X that are monitored within the integration time of thesensor measuring the elements of {right arrow over (d)} (e.g., withinthe frame integration time of a camera). A new set of basis functions isused to formulate the general form of the J matrix.

$\begin{matrix}{{J_{m,n} = {\frac{1}{S} \cdot {\sum\limits_{s = 1}^{S}{c \cdot I_{m,n,s} \cdot ^{2{{\pi } \cdot X_{m,s} \cdot Y_{n}}}}}}},} & (34)\end{matrix}$

This general form of the J matrix can be simplified for variousdistortion monitoring scenarios, two of which are outlined in thefollowing.

In certain embodiments, the intensities and scanner positions aremonitored once per camera frame, intensity changes are small within acamera frame (given for short camera shutter times, for example) andintensity fluctuations of the light source affect all frequenciesequally. The calculation of averages in Eq. 34 is limited to onesummand. I is a function of frame m only. Eq. 34 simplifies to aformulation of the J matrix that accounts for light source intensityfluctuations.

J _(m,n) =c·I _(m) ·e ^(2πi·X) ^(m) ^(·Y) ^(n) ,  (35)

In some embodiments, intensities and scanner positions are monitoredonce per camera frame, intensity changes due to the scan are significantwithin a camera frame (long camera shutter times) and intensityfluctuations are frequency dependent. Although only one scanner positionis measured per camera frame, an estimate can be given for the motion ofthe scanner within the frame integration time and the consequent effecton the measurement. Assuming a linear motion of the scanner betweenframe m−1 and m+1, the quantity X will change fromX_(m)−T·FR·(X_(m+1)−X_(m−1))/4 to X_(m)+T·FR·(X_(m+1)−X_(m−1))/4 withinthe camera frame m, where T is the integration time of the camera framesand FR is the frame rate of the camera measured in Hz (1/s). The sum inEq. 34 is replaced by an integral which after solution results in

$\begin{matrix}{{J_{m,n} = {{c \cdot I_{m,n} \cdot \sin}\; {{c\left( {T \cdot {FR} \cdot \frac{X_{m + 1} - X_{m - 1}}{2} \cdot Y_{n}} \right)} \cdot ^{2{{\pi } \cdot X_{m} \cdot Y_{n}}}}}},} & (36)\end{matrix}$

where the definition sinc(x)=sin(πx)/πx was used and a constant lightsource intensity was assumed within the camera frame integration time.The expression in Eq. 36 reflects a frequency dependent reduction of thefringe contrast due to finite frame integration times of the camera. Forthe first and the last camera frame, the fraction within the sincfunction is replaced by X_(m+1)−X_(m) and X_(m)−X_(m−1), respectively.

There are interferometric applications where the functions I in Eq. 34or the function X in Eqs. 29 and 34 cannot be expressed for all camerapixels equally. In those cases, the J-matrix has to be calculated forindividual camera pixels or groups of camera pixels. Possible reasonsfor pixel dependent variations include tip-tilt like motion of theinterferometric cavity perturbing the piston-like scanning motion,vignetting predominantly affecting pixels at the edge of the field ofview, or varying surface normal angles with respect to the scan motion(e.g., when measuring spherical surfaces using a Fizeau typeinterferometer with a reference sphere)

Applications that do not require a spectral analysis of the signal perse can also benefit from a signal analysis using the J-matrix approach.Since the described procedure can be seen as a substitute for a DFT, aninverse DFT of the calculated spectrum will reveal a signal equivalentto the original signal sampled at even increments and freed of any otherinfluences that were considered in the calculation of the J-matrix(light source fluctuations, fringe contrast reduction due to finiteframe integration times, etc).

Three variations of the J-matrix approach are summarized in the flowcharts shown in FIGS. 11, 12A, and 12B. Specifically, the flowchart inFIG. 11 illustrates spectral analysis using the J-matrix approach, theflow chart in FIG. 12A illustrations the extended J-matrix J ^(ext) withcompensating for further signal distortions, while FIG. 12B illustratesthe use of the J-matrix formalism for the reconstruction of correctedinterferometry signals.

Referring to FIG. 11, the J-matrix approach involves a data generationportion (1151) and a spectral analysis portion (1133), resulting in Nspectra being produced (1159). Data generation 1151 includes, forexample, data acquisition and the scan-motion determination (1153),which provides N scan-positions (1155) and N interferometric data sets(1157) to the spectral analysis portion (1133). The N scan-positions1155 may not be equidistant but a deviation is known from the determinedscan-motion history. The N interferometric data sets 1157 correspond tothe low coherence interferometry signals acquired using the primarysource and detector of the interferometry system.

Spectral analysis 1133 involves the spectrally decomposition of the Ninterferometric data sets 1157 and provides N spectra 1159 as output forfurther analysis. Specifically, spectral analysis 1133 includescomposing the J-matrix (1161), inverting the J-matrix (1163), andmultiplying the inverted J-matrix with the data sets 1157 (1165).

To compose the J-matrix, one first calculates basis functionscorresponding to different frequencies (1161A) and then forms theJ-matrix with the basis functions as columns (1161B). In general, thebasis functions correspond to values of pure oscillatory signals at thegiven disturbed scan-positions.

The N-spectra 1159 can be directly used for the evaluation of the scanor can alternatively, or in addition, be used to reconstruct correctedinterferometry signals based on, e.g., the (unmodified) basis functionsof the DFT.

Referring now to FIG. 12A, for the extended J-matrix, data generatingportion (1271) is similar to that for the J-matrix approach except theportion measures additionally further signal-distorting influences 1273that are then also considered for composing the J-matrix. Specifically,the basis functions for the extended J-matrix correspond to values ofpure oscillatory signals at the given disturbed scan-positions modifiedaccording to the further signal distorting influences 1273. Spectralanalysis 1233 includes similar steps to the J-matrix approach, however,composing the J-matrix involves calculating basis functionscorresponding the different frequencies that are modified based on therecords of further signal distorting influences 1273.

The flowchart shown in FIG. 12B illustrates the application of theextended J-matrix where the N spectra 1159 are calculated in wayidentical to the procedure outlined in FIG. 12A. Subsequently, thecorrected spectra are used to reconstruct a set of N correctedinterferometric data sets 1211 that are derived by the application of aninverse DFT 1212.

FIGS. 13A-15C illustrate via numerical experiment how the J-matrixmethod performs compared to a conventional DFT when applied to differentlow coherence signal examples.

FIGS. 13A-13E illustrate data for a vibration and camera noise freesignal (i.e., a signal having no scan errors). FIG. 13A shows the signalitself, which is a synthetically generated cosine with a Gaussianenvelope. The solid line is the undisturbed continuous signal, whereasactual data points are indicated by the dots. Those signal plots showonly about a quarter of the whole SWLI signal. FIGS. 13B-13E show thespectrum amplitude retrieved by the DFT and the J-matrix method as wellas the error magnitude of the spectrum. Specifically, FIGS. 13B and 13Dshow the spectrum and spectrum error when using the DFT method whileFIGS. 13C and 13E show the spectrum and spectrum error when using theJ-matrix method. In the absence of scan errors, the DFT and J-matrixfrequency spectra are identical Gaussian distributions and both havezero spectrum error.

FIGS. 14A-14E show similar plots for data as those shown in FIGS.13A-13E, however here the data points are still on the ideal curve buttaken at unevenly distributed scan positions. As can be seen in FIG.14B, when using the DFT method, the scan errors result in a frequencyspectrum that deviates from the ideal Gaussian curve. The informationabout the exact sample locations is lost when using the standard DFTmethod and therefore leads to errors in the spectrum, as is evident fromFIG. 14D. FIGS. 14C and 14E, however, shows that J-matrix method stillretrieves an error-free spectrum.

FIGS. 15A-15E show similar plats as those shown in FIGS. 13A-13E, butexcept that here both uneven sampling and a floor noise affect thesignal. As can be seen in FIG. 15A, the result is that the data pointsdeviate from the ideal curve in addition to being distributed at unevenscan increments. Referring to FIGS. 15B-15E, the floor noise causes boththe DFT and J-matrix spectra to deviate from being smoothly-varyingfunctions and introduce errors in the spectrum. However, in general, themagnitudes of the errors are larger in for the DFT method than theJ-matrix method.

In the examples discussed above in relation to FIGS. 13A-15E, the samplepositions were set to deviate from strictly equidistant positions byabout 1/16th of a period RMS and the camera noise level in FIGS. 15A-15Ewas 1% RMS of the full signal range.

In practice, the benefit of using the J-matrix method depends on themixture of error sources. For example, where vibration is the dominantsource of error and the vibration can be monitored, the J-matrix canlead to a substantial improvement in measurement accuracy. Whereunmonitored noise is dominant, the J-matrix approach may not helpsignificantly.

While the J-matrix method has been discussed in relation to improvingthe accuracy of measurements made using a low coherence interferometer(e.g., a SWLI interferometer), more generally it can be applied to othertypes of interferometry data. For example, the J-matrix method can beused to analyze signals acquired using a long coherence lengthinterferometer (i.e., that include sinusoidal fringes but not modulatedwith a Gaussian envelope like a SWLI signal). Without wishing to bebound by theory, use of the J-matrix on such a signal is demonstratedusing numerical experiment. Referring to FIGS. 16A-16B, for example, asignal composed of 80 periods of a pure sine-wave are sampled with only100 samples at completely random sampling positions in the giveninterval. FIG. 16A shows a plot of the signal, where the sample datapoints are shown by dots on the sinusoidal curve. In a Nyquist sense,the signal is under-sampled. Referring specifically to FIG. 16B, the 100data points were analyzed with a 100×100 J-matrix, where the J-matrixwas composed of basis functions that correspond to 50 to 99 periods inthe given interval and their negative counterparts. It was assumed thatsome knowledge about the frequency content exists. Selective frequencybands were used to define the basis functions. The data was noise-free.The J-matrix spectrum shows a distinct peak at 80 cycles per interval,indicating that the J-matrix method performs reliably.

Referring to FIGS. 17A-17C, a second numerical experiment was performedusing the same data as shown in FIG. 16A, with additional noisecorresponding to 2% of the signal range added to the signal. TwoJ-matrix analyses were performed on this data. Referring specifically toFIG. 17B, in the first analysis, a badly-conditioned 100×100 J-matrixmethod was used yielding an error-filled frequency spectrum. Referringto FIG. 17C, in the second analysis, the data was analyzed using a100×80 J-matrix, resulting in distinct peaks at the correct frequency.

Referring to FIG. 18, numerical experiments were performed in which theextended J-matrix was used to recover a distorted interferometric signalas opposed to just calculating the corrected spectrum of a signal. Theexample shows six possible signals of a low coherence interferometer(labeled (a)-(f)) where from signal (b) to signal (e) more and moresignal distorting influences were added. The series starts with signal(a), which shows an undistorted interferometric signal. Signal (b)corresponds to a scan with uneven scan increments. Some degree of lightsource fluctuations is added in signal (c), while in signal (d) theeffect of a finite frame integration time was included. This effect ismost obvious around frame 128. The final noise source added was cameranoise, resulting in the distorted interferometric signal (e). The basisfunctions of the extended J-matrix included all signal distortinginfluences but the camera noise, which cannot be independentlymonitored. After calculation of the spectrum, an inverse DFT revealedthe corrected interferometric signal (f). The original undistortedsignal is overlaid for comparison as a dashed line. In this experiment,a rectangular 256×181 element extended J-matrix was used with the higherfrequency range removed.

As discussed previously, information about the unevenly sampled scanpositions, X_(m), can be provided from a variety of sources. Of course,in some embodiments, the information is provided based on measurementsof a monitor system, for example, as described in connection with theembodiments shown in FIGS. 1, 7, 9, and 10. However, more generally, theinformation can be provided from other sources. For example, theinformation can be obtained using accelerometers, touch probes,capacitive gages, air gages, optical encoders (e.g., linear opticalencoders), or from techniques based on interpretation of the lowcoherence interferometry data themselves.

Compound Reference

In some embodiments, information about the scan errors is determinedusing a compound reference. A compound reference is a reference objectthat has at least two reference interfaces: a primary referenceinterface and a secondary reference interface.

The primary reference interface is configured as a conventionalreference interface while the secondary reference interface isconfigured provide information that allows one to monitor thedisplacement of the test object relative to the interference microscopewhile scanning the OPD of the interference microscope. In general, thesecondary reference interface is mechanically fixed with respect to theprimary reference interface.

The effect of the primary reference and secondary reference interfacesis to provide a field-dependent complex effective reflectivity thatvaries at least in phase over the field of view of the system. Ingeneral, the effective reflectivity is structured to facilitatedetermining an overall or low-spatial frequency phase offset for theinterference image.

The operating principle of a compound reference is described inconnection with FIGS. 19-31.

FIG. 19 shows a simplified diagram of an embodiment of a laser Fizeauinterferometry system 2000 including a light source 2163, a beamsplitter 2198, an interferometric cavity formed by a test object 2175and a compound reference 2100, which has a primary reference surface2181A with a reflectivity r₁ and a secondary reference surface 2181Bwith a reflectivity r₂. Compound reference 2100 is displaceable inZ-direction with an actuator 2193 (also referred to as a phase shifter)to perform an interferometric scan. Interferometry system 2000 includesfurther a primary camera 2191 and an aperture 2106, and a secondarycamera 2199 (also referred to as a monitor camera). FIG. 19 does notshow additional optical elements such as lenses or other features of animaging interferometry system some of which are explained, for example,in connection with FIG. 28.

Secondary reference surface 2181B is oriented so that light reflectedtherefrom is blocked from primary camera 2191 but is incident onsecondary camera 2199. Monitor camera 2199 and compound reference 2100work together to determine a characteristic of the interferometer cavitysuch as the instantaneous average optical path length change (alsoreferred to as piston) with respect to a starting position of a scanmovement initiated with actuator 2193.

Monitor camera 2199 views an interference pattern created by primaryreference surface 2181A, secondary reference surface 2181B of compoundreference 2100, and test object 2175, while primary camera 2191 viewsonly the two-surface interference of primary reference surface 2181A andtest object 2175. The information about the interferometer cavitygathered by monitor camera 2199 facilitates, for example, generation ofthe object 3D surface height by providing information about the overalloptical path to test object 2175 even in the presence of vibration orair turbulence.

Without wishing to be bound by theory, interference signals aregenerated using system 2000 as follows. It is assumed that in FIG. 19,the surface of test object 2175 has a complex reflectivity r₀, primaryreference surface 2181A has reflectivity r₁, and secondary referencesurface 2181B has reflectivity r₂. All of these reflectivities can havea dependence on the lateral coordinates x, y. Light originating fromlight source 2163 partially reflects from both the primary and secondaryreference surfaces 2181A and 2181B, as well as from the surface of testobject 2175. However, primary camera 2191 only detects light reflectedfrom primary reference surface 2181A and test object 2175, becausesecondary reference surface 2181B is tilted in such a way that itsreflection is blocked by aperture 2106. Monitor camera 2199, on theother hand, does not have an aperture and therefore sees all threereflections.

The interference detected with primary camera 2191 can be described as

I=R ₀ +R ₁+2√{square root over (R ₀ R ₁)} cos(θ−φ)  (37)

where the intensity reflectivities are

R ₀ =|r ₀|²  (38)

R ₁ =|r ₁|²  (39)

and the phase θ is proportional to the object surface height h

$\begin{matrix}{h = {\frac{\lambda}{4\pi}\theta}} & (40) \\{\theta = {\arg \left( r_{0} \right)}} & (41)\end{matrix}$

and the phase profile offset related to the reference is

φ=arg(r ₁)  (42)

For monitor camera 2199, the interference can be described as

I=P+R ₀+2√{square root over (R ₀ P)} cos(θ−Θ)  (43)

where

P=|ρ ₁|²  (44)

Θ=arg(ρ)  (45)

given the effective compound reference reflectivity

ρ=r ₁ +r ₂.  (46)

As an example, FIG. 20 illustrates the compound intensity reflectivityprofile P calculated by simulation over a grid of 100×100 pixels, forthe case of no test object 2175 being present and a relative tiltbetween primary reference surface 2181A and secondary reference surface2181B that accumulates to two wavelengths of optical path difference, aprimary reflectivity R₁ of 4% and a secondary reflectivity R₂ of 0.4%over the full field-of-view (FOV).

FIG. 21A shows a cross section of FIG. 20 in the x (i.e., horizontal)direction of the image, showing more quantitatively the intensityprofile P resulting from the combination of the two reference surfaces(Eq. (44)). FIG. 21B shows how the complex phase Θ of compound reference2100 varies over the same lateral cross section as the intensity profileof FIG. 21A.

Introducing test object 2175, FIG. 22 shows a monitor interferencepattern I as viewed by monitor camera 2199 for the case of test object2175 having a reflectivity of R₀=2% being introduced and being slightlytilted with respect to primary reference surface 2181A along thediagonal from upper left to lower right of monitor interference patternI. The intensity variations are primarily related to compound reference2100, and are not visible with primary camera 2191.

A simulated interference image detected with primary camera 2191 isshown in FIG. 23. The difference between the interference detected withprimary camera 2191 and the interference detected with monitor camera2199 is also evident in the cross-sectional profiles shown in FIGS. 24A,24B, 25A, 25B. Specifically, FIG. 24A shows the interference variationon monitor camera 2199 for the compound reference as in FIG. 19 withslightly tilted test object 2175 of a 2% reflectivity and FIG. 24B showsthe corresponding phase variation as viewed by monitor camera 2199.

For the same parameters, FIG. 25A shows the interference variation onprimary camera 2191 for the compound reference and slightly tilted testobject 2175 and FIG. 24B shows the corresponding phase variation asviewed by primary camera 2191.

During operation, phase shifter 2193 mechanically displaces compoundreference 2100 with respect to test object 2175. This results in asequence of phase shifts for the signals as viewed by monitor camera2199 and by primary camera 2191. The phase shifts are identical for thetwo cameras, even though the interference signals may be very different,as illustrated in the figures. Therefore, a determination of the phaseshifts as viewed by monitor camera 2199 can be useful in the correctinterpretation of the phase shifts in the data acquired by primarycamera 2191.

Several exemplary data processing techniques for determining phaseshifts from monochromatic interference data acquired over time aredescribed above and show that a range of starting phase values improvesthe determination of the instantaneous overall optical path length ofthe interferometer cavity over all vibrational frequencies.

Comparing FIGS. 24B and 25B shows that compound reference 2100 hasvariations in phase across the FOV that are independent of the structureof test object 2175, which is a result of employing compound reference2100 together with monitor camera 2199.

Referring to the flowchart shown in FIG. 26, operating an interferometrysystem (e.g. interferometry system 2000) based on compound reference2100 can include a data acquisition step of monitor data andinterferometric data of test object 2175, data processing of the monitordata, and data processing of the interferometric data using the resultof the data processing of the monitor data.

Specifically, one acquires monitor interference signals with a monitorcamera and interference signals with a primary camera over a range ofimparted phase shifts (step 2010). The monitor camera views interferencepatterns that include contributions from both the primary and thesecondary reference interfaces, while the primary camera viewsinterference patterns that include contributions from the primaryreference alone.

Then, one analyzes the monitor interference signals to determine thephase shifts that took place during data acquisition (step 2020).

Using the information about the phase shifts determined from the monitorinterference signals, one then analyzes the interference signalsdetected with the primary camera and determines, for example, the 3Dsurface height of the surface of the test object (step 2030).

The data processing outlined in FIG. 26 illustrates an example approachfor using data acquired with a compound reference introduced in aninterferometer. However, other types of data processing may be employedto determine object surface characteristics using the compoundreference. For example, the intensity pattern evident in FIG. 20, whichincludes a dense pattern of fringes, may be analyzed using spatialmethods that interpret interference fringe locations. Additionalexamples are disclosed, for example, in M. Kujawinska, Spatial phasemeasurement methods, in: Interferogram analysis, D. W. Robinson and G.T. Reid, Eds, (Bristol and Philadelphia, Inst. of Physics Publishing,1993) pp. 145-166, the contents of which are incorporated herein byreference.

While in FIG. 19 a single optical element is used to provide the firstand second reference surfaces, other configurations are also possible.For example, in some embodiments, the first and second referenceinterfaces that are part of different optical elements but where theoptical elements are mechanically fixed with respect to each other.

For example, FIG. 27 shows a interferometry system 2001 that includesmany of the elements as discussed in connection with FIG. 19. However,instead of compound reference 2100, a compound reference assembly 2200is used in which the primary and secondary reference surfaces are partof separate optical elements. Specifically, compound reference assembly2200 includes a first optical element 2202A and a second optical element2202B each mechanically fixed with respect to each other by virtue ofbeing mounted to a common mounting flange 2204.

Referring to FIG. 28, in some embodiments, interferometry system 2001can include a light source and detection unit 3210 that includes variousoptical beam guiding elements. For example, relay optics 2169 and 2171direct light from light source 2163 to beam splitter 2164, which thenpasses aperture 2106 and is collimated by collimator optics 2177.Returning from the interferometric cavity, light is partly imaged withan imaging lens 2189 onto primary detector 2191. Light is also picked upwith beam splitter 2198 to be directed to monitor camera 2199 onto whichit is imaged by a lens 2190.

While interferometry system 2001 is configured to investigate planartest objects, other configurations are also possible.

For example, FIG. 29 shows an interferometry system 2002 that includes alight source and detection unit 3215 and a compound reference 2250.Light source and detection unit 3215 is similar to light source anddetection unit 3210. However, compound reference 2250 differs fromcompound reference 2200 in that it is configured to form a spherical,rather than planar, wavefront, to illuminate a curved test object 3175.Specifically, compound reference 2250 includes a first optical element2252A, a lens 2258, and a second optical element 2252B. Lens 2258 andsecond optical element 2252B are mounted together in a single unit,which is mechanically fixed to second optical element 2252B via mountingflange 2204. First optical element 2252A provides a curved firstreference surface 2181A and second optical element provides a planarsecond reference surface 2181B, thereby providing a field-dependentcomplex effective reflectivity of the interferometric cavity that variesin phase over the FOV of interferometry system 2002.

While in some embodiments such as the one shown in, e.g., FIGS. 20 and27 the monitor image is separated from the primary image by geometry(e.g., by blocking light from the secondary reference interface from theprimary camera), other configurations are also possible. For example, incertain embodiments the monitor image can be separated from the primaryimage by wavelength.

As an example, FIG. 30 illustrates an interferometry system 2003configured to use a monitor image (e.g., monochrome monitor image) tomonitor the displacement of a test object relative to the interferencemicroscope while scanning the OPD of the interference microscope.

Specifically, interferometry system 2003 includes an interferometricplatform 3310, a monitor assembly 3300, and an interference objective3167. Interferometric platform 3310 includes a broadband source 3163, abeam splitter 3170, and an imaging lens 3189 for imaging an interferencepattern onto a white light camera 3191. In addition, interferometricplatform 3310 includes a pickoff mirror 3308, a monitor imaging lens3190, and a monitor camera 3199.

Interferometric platform 3310 is attached to monitor assembly 3300 andinterference objective 3167 via a mechanical scanner 3193 whichdisplaces the subsystem of monitor assembly 3300 and interferenceobjective 3167 with respect to test object 2175.

Monitor assembly 3300 includes a secondary light source 3197 (e.g., anarrowband source, such as a monochrome source), a partial mirror 3304(e.g., a 50/50 minor) at monitor wavelength(s) only, a reference lens3306, and a secondary reference 3302B with secondary reference surface2181B.

Interference objective 3167 includes an objective lens, aninterferometer beam splitter 3179, and a primary reference mirror 3302Aproviding primary reference surface 2181A.

Monitoring the displacement of test object 2175 is done via a monitorimage, relying on separate secondary light source 3197. The monitorimage is formed via 3-surface interference including a fixed complexreflectivity for effective reference surface of primary referencesurface 2181A and secondary reference 2181B. The monitor image is usedfor determining phase shift corrections. In some embodiments, thequality of the monitor image can be less than the SWLI interferenceimage.

In general, the phase modulation history can be evaluated at each pixelof the monitor image independently, for example, by cosine inversion. Tocorrect the SWLI data acquisition, the knowledge of phase shifts canthen be used to interpret the white SWLI image correctly. A benefit thismonitoring approach is that a conventional interference objective can beused that does not (or only to a small extent) need to be modified.Accordingly, such a configuration of a monitor mechanism can beconfigured to be compatible with standard objective designs.

While the interferometry systems described in connection with FIGS. 19to 30 are configured for SWLI, alternative operation modes are alsopossible. For example, referring to FIG. 31, interferometry system 2004is configured for PUPS imaging. Here, the monitor image is separatedfrom the PUPS image by wavelength similar to interferometry system 2003.The broadband and narrowband light are generated by a common lightsource unit that couples light into an interferometric objective 5167with a lens 5177 via a common beam splitter 5170. The light source unitincludes a broadband light source 5163, lenses 5169 and 5171, a monitorlight source 5197, and a beam splitter 5164. The illumination is focusedto a single point 5400 on test object 2175. Interferometric objective5167 can be scanned with a translation stage 5193.

In interferometry systems 2004, optical elements, e.g., a tube lens 5198and a beam splitter 5189, are arranged such that both a primary camera5191 and a monitor camera 5199 are located at a surface conjugate to apupil of test objective 5167. A secondary reference with secondaryreference surface 2181B is positioned such that secondary referencesurface 2181B is tilted with respect to primary reference surface 2181A.Secondary reference surface 2181B is partially reflective for themonitor wavelength(s), thereby introducing a range of phase offsets forthe resulting three-surface interference.

Image information at primary and monitor cameras 5191 and 5199 areprovided to a control computer 5192 with a processor. Control computer5192 also interacts with translation stage 5193.

While certain embodiments that include compound references have beendescribed, in general, other constructions are also possible. Forexample, while the described embodiments featuring a compound referenceall include a secondary camera for capturing the monitor information, insome embodiments a single camera can be used. For example, the secondaryand primary cameras may combined into a single camera having separateFOV's for the primary and monitor images.

Moreover, one can use time-multiplexed acquisitions, or simply a singleimage that is processed to determine simultaneously the overallinterference phase offset and object surface characteristics in separateor simultaneous data processing steps.

The compound reference may be constructed from two or more referencereflections of any desired shape, such as flat, spherical, aspheric orother. Further, the compound reference may act over the entire field ofview, or only a portion of the field of view.

Displacement Measuring Interferometers

In some embodiments, information about the scan errors is determinedusing a displacement measuring interferometer (DMI) that is separate(e.g., does not utilize common optical components) from the interferencemicroscope and configured to monitor the displacement of the test objectrelative to the interference microscope while scanning the OPD of theinterference microscope. An example of such a system is shown in FIG.32, which shows interference microscope 110 modified so that it nolonger includes secondary source 197 and secondary detector 199. Rather,a displacement measuring interferometer 1801 that utilizes, for example,a laser source, is mounted to Mirau objective 167 and configured todirect a measurement beam to reflect from test object 175. DMI 1801 isconnected to computer 192 and during operation sends an interferencesignal to computer 192. Computer 192 monitors, based on the interferencesignal, the relative displacement between Mirau objective 167 and testobject 175 and, in coordination with the operation of interferencemicroscope 110, provides information about the scan errors associatedwith the measurements made using interference microscope 110.

In general, a variety of DMI's can be used. Examples of commerciallyavailable DMI's include, for example, the ZMI Series—DisplacementMeasuring Interferometers, available from Zygo Corporation (Middlefield,Conn.). Further examples of DMI's are also disclosed in U.S. patentapplication Ser. No. 11/656,597, entitled “INTERFEROMETER SYSTEM FORMONITORING AN OBJECT,” filed on Jan. 23, 2007, the entire contents ofwhich is incorporated herein by reference.

In some embodiments, the light source used by DMI 1801 is included inthe assembly mounted to Mirau objective 167. In certain embodiments, thelight source can be housed remote from the objective and light for theDMI can be directed to the DMI via, e.g., a fiber waveguide. Examples ofsuch systems are disclosed, for example, in U.S. patent application Ser.No. 11/656,597. Such arrangements can be advantageous in that the actualassembly mounted to the objective can be small and relativelyunobtrusive, while the processing electronics and light source areremote from the objective.

In certain embodiments, multiple DMI's can be used to monitor thedisplacement of a test object during a scan. For example, U.S. patentapplication Ser. No. 11/656,597 discloses systems that include multipledetection channels, each using a DMI for measuring the displacement(e.g., relative or absolute) at a different location.

Fiber-Based Sensor Systems

Various examples of implementations of a fiber based DMI systems (alsoreferred to as “sensor systems”) for scan error monitoring are describedin connection with FIGS. 33A-48B and 53.

In some embodiments, implementing a sensor system into an interferometrysystem can further allow determining the position of a monitor surface,e.g., a surface of the test object or the reference object. This can beused, for example, to determine a relative distance of the test objectto an internal reference plane within an autofocusing mechanism of theinterferometry systems.

FIG. 33A shows an example of a sensor system 4000 including a subsystem4010 and sensors 4099A and 4099B attached to, as an example, a Mirauobjective 4167 of an interferometry system 4110.

Subsystem 4010 includes a broadband source 4020, a widely-tunableinternal cavity 4030 (cavity 4030 is also referred to as a “remotecavity” because it is remote from sensors 4099A and 4099B) illuminatedwith light from source 4020, a light distribution module 4040 receivinglight from internal cavity 4030 and distributing light among variouschannels 4050 to 4053, and detection and phase meter electronics 4060with an individual detection module 4070 to 4073 (e.g., photodetectors)for each of the channels 4050 to 4053, respectively.

More specifically, broadband source 4020 can be, e.g., asurface-emitting LED that emits at a central wavelength far removed fromwavelengths used in the interferometry system 4110. For example, source4020 can have a power of about 9 mW, a central wavelength of 1550 nm, aspectral width at full width half maximum of 30 nm, and a coherencelength of about 50 μm.

The light from source 4020 is guided using fiber cables 4012 andisolators 4014 and 4016 to avoid system distortions due to feedback frominternal cavity 4030 to source 4020 and light from light distributionmodule 4040 to internal cavity 4030, respectively. Isolators 4014 and4016 can, for example, provide a 30 dB suppression of returning light.

Within the sensor system, 50/50 fiber couplers can be employed atseveral positions to separate, distribute, and/or combine incomingand/or outgoing light. For example, internal cavity 4030 includes a50/50 fiber coupler 4095 connected on one side with source 4020 andlight distribution module 4040. On the other side, coupler 4095 isconnected with two legs of internal cavity 4030 having a OPD that can bevaried. Each leg includes a fiber stretching module (FSM) 4032A, 4032Bof, for example, 10 m optical fiber, each FSM set to operate in apush-pull mode to produce a tunable OPD. Each leg includes further aFaraday mirror 4034B, 4034B, respectively, which can reduce contrastfading due to polarization changes in the fiber paths.

The OPD for the light propagating along the two legs of the internalcavity is controllable, for example, by extending or shortening theoptical path using FSMs 4032A and 4032B. In some embodiments, the OPDcan be, for example, varied over a range of at least 3 mm, for example,over a range of 10 mm. When leaving internal cavity 4030, the light fromthe two legs recombines in coupler 4095.

As another example, 50/50 fiber couplers are used to split incoming andreflected light within the various channels 4050-4053 such that thelight returning from the sensors is directed to phase meter electronics4060 after passing through the couplers. In particular, coupler 4090provides reference cavity 4080 with light from channel 4050 of lightdistribution module 4040 and directs light from reference cavity 4080 todetection module 4070. Similarly, 50/50 fiber coupler 4091 providessensor 4099A with light from channel 4051 of light distribution module4040 and directs light from sensor 4099B to detection module 4071. Inthe same manner, couplers 4092 and 4093 interact with light from theirassociated channels and sensors.

With respect to the motion measurement, the sensors can generally beattached to physical objects to monitor, alone or in combination, anappropriate degree or degrees of freedom, e.g., with respect to areference position. For example, as illustrated in FIG. 33A, channels4051 and 4052 are connected to sensors 4099A and 4099B, respectively,which measure the distance between test object 4175 and sensors 4099Aand 4099B and, therefore, Mirau objective 4167. Each sensor has its ownsensor cavity and the distance measurements are based on variations inthe OPD of the sensor cavity. Channels 4051 and 4052 are also referredto as measurement channels. An example of a sensor configuration isdescribed in connection with FIG. 34 (see below).

To provide a reference signal, a reference cavity 4080 is connected withchannel 4050. As discussed in connection with FIG. 35 (see below),reference cavity 4080 has a configuration similar to sensors 4099A and4099B, except that the OPD of reference cavity 4080 is fixed. Channel4050 is also referred to as a reference channel.

Each of the sensors 4099A and 4099B are configured to observe a sensorcavity that together with internal cavity 4030 forms an independentcoupled-cavity interferometer. The sensor cavity is formed, for example,between a reflecting surface of the sensor and a reflecting surface ofan observed part. In the configuration of FIG. 33A, the reflectingsurface of the sensors is the last face of the sensors end and thereflecting surface of the observed part is the surface of the testobject. In such a configuration, the OPD of the sensor cavity changesproportionally to the scan motion along the axis of the Mirau objective4167.

An exemplary configuration of a sensor 4100 is illustrated in FIG. 34.Here, a thermally expanded core (TEC) fiber 4102 is attached to a gradedindex (GRIN) lens 4104. Sensor 4100 is designed to provide a beam ofspecific width at a beam waist position 4106. To facilitate theplacement of the beam waist location during sensor manufacture, a gapbetween GRIN lens 4104 and TEC fiber 4102 can be incorporated that isadjusted during manufacture to set the beam waist position 4106 relativeto last face 4108 of sensor 4100. During operation, sensor 4100 forms asensor cavity with a target surface 4112 of a target 4114. Target 4114can be, for example, test object 4175 or an optical element, or aportion of a mount of one of those elements.

In the configuration of sensor 4000, last face 4108 of GRIN lens 4104can be used as a reference surface if required. Then, last face 4108 andtarget surface 4112 form the sensor cavity. Alternatively, last face4108 can be anti-reflection (AR) coated to reduce surface reflection.Depending on the application, sensor 4100 may or may not use last faceas a reference surface. Sensor 4100 is of simple configuration and canbe reduced in size and cost.

The desired surfaces contributing to the sensor cavity can be selectedby adjusting the geometry of the coupled-cavity interferometer becausethe restricted coherence length of the illuminating light can excludeinterference from unwanted surfaces.

An exemplary configuration of a reference cavity 4200 is shown in FIG.35. Reference cavity 4200 includes a fiber cable 4202 to receive lightfrom distributor 4040. A GRIN lens 4204 collimates the beam into a fixedOPD Fabry Perot (FP) cavity. In some embodiments, the reference OPD isadjusted to be, for example, twice the standoff distance D, which asindicated in FIG. 34, is equal to the distance from last face 4108 tothe test surface for the case of the best focus of the objective.

Referring again to FIG. 33A, during operation of sensor system 4000,light of the appropriate coherence and intensity is supplied to internalcavity 4030 providing a controllable OPD between the two legs. Afterpassing through internal cavity 4030, fiber distribution system 4040splits light amongst the various measurement channels 4051-4052 andreference channel 4050. Isolators 4014 and 4016 assure that theillumination performance is not compromised by optical feedback.Measurement channels 4051-4052 direct light to and from sensors 4099Aand 4099B, which are attached to the interferometry system 4110 in sucha way as to form a sensor cavity whose OPD depends on a degree offreedom that is to be monitored by the respective sensor. The lightreturns within measurement channels 4050-4052 along the sameillumination fibers 4012 and is directed to electronics 4060, whichdetect and process the signals of one or more channels to deriveinformation about the monitored degree(s) of freedom.

Tuning the OPD of internal cavity 4030 varies the phase modulation,which is used to determine the interferometric phase(s) and OPD(s) ofthe sensor cavity in the measurement channel. Sensor system 4000 canemploy the phase modulation for the following measurement modes: acoherence scanning mode and a motion (or phase) monitoring mode. Sensorsystem 4000 can be configured to rapidly switch between these modes asneeded.

In the coherence scanning mode, the OPD of the sensor cavities can bedetermined within the tuning range of internal cavity 4030 by findingthe point in the internal cavity tune, where the modulation of thecoherence signal in the respective channel is maximum. The coherencescanning mode can be used, for example, within an autofocus mechanism asdescribed below in connection with FIGS. 38 and 39.

In the coherence scanning mode, the OPD of internal cavity 4030 isvaried with a large amplitude while the phase meter electronics 4060searches for the coherence peak (maximum interference modulation) formeasurement channels 4051-4053, for example, simultaneously and in realtime. The OPD of internal cavity 4030 when the channel coherence ismaximum determines the OPD of the sensor cavity associated with thatchannel. Specifically, with proper setting of the reference cavity OPD,the distance between peak interference positions of reference channel4050 and of a measurement channel 4051 or 4052 shows the relativeposition of, e.g., test object 4175 from the best focus position.

The motion monitoring mode can be used, for example, for vibrationmonitoring.

In the motion monitoring mode, the interferometric phase of ameasurement channel 4051-4053 is measured at high speed (e.g., about 50kHz or more). Thus, one can monitor the OPD variation of one channelrelative to any other channel, provided the measurement channels4051-4053 are within the coherence peak of the illuminating light.

In the motion monitoring mode, the OPD of internal cavity 4030 is variedat high frequency with small amplitude in a manner that allows theinterference phase of the sensor cavity or cavities to be calculatedwith a phase extraction algorithm at a high update rate. The rate ofchange of a sensor cavity is assumed to be small enough so that theinterferometric phase change between adjacent samples is less than π,allowing continuous phase interpolation via standard phase-connectmethods.

In the motion monitoring mode, reference channel 4050 can be used tosubtract changes in the optical path within internal cavity 4030 fromthe measured phase corresponding to the motion of the observed testsurface. For example, reference channel 4050 can accommodate a drift ofinternal cavity 4030 as long as the drift is slow relative the updatefrequency of the measured phase.

In some embodiments, the light beam emitted from the sensor propagatesapproximately parallel to the motion axis of the microscope stage toreduce misalignments which can introduce an error in the measured motionproportional to the cosine of the misalignment angle. The return loss ofa sensor is also dependent on the incident angle of the illuminatinglight on the test surface an, in particular, can increase as a functionof target surface tilt. In general, the tilt sensitivity of a sensordepends on the details of the sensor design and can depend, for example,on the distance between the GRIN lens and the beam waist position—knownas the sensor working distance. In general, aligning the sensor emissionperpendicular to the nominal surface plane of the observed part canenlarge the usable tilt phase space.

In the embodiment shown in FIG. 33A, the OPD of the internal cavity 4030when the FSMs are not energized is defined as the “nominal OPD”. If thesensors are to be used for autofocusing, the OPD of a sensor cavityshould be close to the nominal OPD when the objective is at best focus.This way the interference peak contrast position can be used to identifybest focus.

The FSMs used to control the OPD of the internal cavity can betemperature sensitive, with an OPD temperature coefficient of, forexample, about 10 ppm/C. Bringing the two FSMs in intimate thermalcontact can minimize OPD variations from temperature differences.Moreover, the FSMs can be driven by PZTs that experience creep. Thecreep is caused by a realignment of PZT domains due to electrostaticstress under thermal agitation, which typically has a logarithmic timedependence. Finally, it can be difficult to physically match the fiberlengths of the two legs of the internal cavity during fabrication.

In view of the OPD variability, one can use one channel as a fixedreference cavity of a compensation mechanism. In some embodiments, anOPD of the reference cavity is set to be equal to the nominal OPD of theinternal cavity. An example of a fixed reference cavity is shown in FIG.35.

The reference channel can be acquired simultaneously and synchronouslywith the remaining measurement channels. When analyzing the signal ofthe monitor channels, one can subtract the reference phase from thephase measurements. Thus, to the extent that the reference cavity OPD isfixed, any OPD variation of the internal cavity can be subtracted out aslong as that variation is small compared to the coherence length so thatthe reference signal is never lost.

The reference cavity further can be used to define the nominal OPDposition, which can corresponds to the objective best focus position forautofocusing.

As an example, the operation of a microscope with a sensor system isdescribed in connection with FIGS. 36-38. The sensor system can be, forexample, a sensor system as described above in connection with FIG. 33A.The operation includes an autofocus function of the sensor system and amotion (or phase) monitoring function.

As indicated in the flow chart 4300 of FIG. 36, a microscope head, e.g.,the objective of an interference microscope, is positioned over ameasurement site at which a test object is positioned (step 4310). Thetest object has a test surface that is to be examined with themicroscope.

Once the autofocus mode of the sensor system is enabled (step 4320) anda OPD scan is performed.

FIG. 37 shows schematically a modulation peak 4410 of a test signal of amonitor cavity and a modulation peak 4420 of a reference signal of areference cavity measured during an autofocus OPD scan. The measuredsignals are analyzed using, for example, an electronic processor thatidentifies the position of the modulation peaks and calculates theposition of the surface of the test object relative to a best focusposition (step 4330). In this example, the best focus position isindicated by the position of the modulation peak 4420 of the referencesignal.

Based on the determined relative position, the microscope then moves thetest surface towards the best surface position by the distance measured(step 4340). The resulting position of the test surface can be verified(step 4350) as shown schematically in FIG. 38, in which a modulationpeak 4410′ of the monitor cavity and the modulation peak 4420 of thereference cavity occur at about the same OPD of the OPD scan. To ensureproper positioning or for refinement, a loop 4355 over step 4330 andstep 4340 can be performed.

Once the microscope has been brought into focus (when the test cavityand reference cavity coherence functions overlap), one sets theautofocus DC voltage of the OPD scan to maximal modulation (step 4360).FIG. 38 shows schematically a monitor signal 4510 and a reference signal4520 of such a high speed sinusoidal scan of the OPD in the sensorsystem. In some embodiments, one further clamps the FSM DC voltage atthe point of maximum interference fringe contrast.

Then, one enables the vibration mode (step 4370), which monitors themotion of the test surface, and starts the SWLI (or PUPS) scanningmeasurement of the test object (step 4380) with the microscope. Thesynchronous measurement of the motion allows calculating and outputtingthe true motion profile, which is synchronized with the SWLI (PUPS) data(step 4390).

Based on the true motion, one can use the measured phase variationstogether with SWLI (or PUPS) analysis to remove scan error contributions(step 4395). This can be done in real time or while post-processing theSWLI (or PUPS) data.

While in the forgoing example the autofocus function and the motionmonitoring function are performed sequentially, each of these functionscan be applied individually and/or multiple times.

In some embodiments using autofocus mode, the OPD scan and theparameters of sensor systems are selected to provide for a workingrange, e.g., greater than 1 mm for a working distance, e.g., of greater5 mm, a position resolution of, e.g., about 100 nm, a positionrepeatability of, e.g., about 250 nm (on structured parts), a spot sizeof about, e.g., about 0.5 mm diameter, and greater speed than about,e.g., 10 Hz.

When applying the autofocus function to a sensor system with FSMs, suchas FSMs 4032A, 4032B in the interferometry system shown in FIG. 33, theFSMs can be energized, for example, with a relatively slow (e.g., ˜10Hz) large amplitude sinusoidal voltage and the test surface position canbe determined from the relative delay between the test and referencecoherence peaks. The total OPD sweep range depends on the length of theoptical fiber in the spools of FSMs 4032A, 4032B and the maximumextension of the PZT of FSMs 4032A, 4032B. Creep and temperaturesensitivity can depend directly on the fiber length, so the optimumamount of fiber to use is often a tradeoff between sweep length andacceptable sensitivity. For example, an FSM using 18 m of optical fiberprovides a 6.6 mm OPD scan, a 9.5 micron/V transfer coefficient and a254 micron/C temperature sensitivity.

In some embodiments using motion monitor mode, the OPD scan and theparameters of sensor systems are selected to provide for a motionresolution of less than 0.2 nm, a repeatability of less then 1 nm (onstructured parts), a sample rate of about 200 kHz, and a updatefrequency greater 5 kHz.

Moreover, when applying the motion monitor function to a sensor systemwith FSMs such as FSMs 4032A, 4032B in the interferometry system shownin FIG. 33A, the FSMs can be energized with a high frequency (e.g., ˜10kHz) waveform (at a DC clamp that provides best interference) with anamplitude that enables the calculation of the cavity interferometricphase at high rates. In some embodiments, this is done with a sawtoothor triangular modulation profile if standard linear phase shiftingalgorithms are used. In other embodiments, the modulation is sinusoidaland a SinPSI algorithm is employed. For example, in the sinusoidal phaseshifting algorithms disclosed in U.S. Patent Application published asUS-2008/0180679-A1 to P. J. De Groot entitled “SINUSOIDAL PHASE SHIFTINGINTERFEROMETRY,” and/or in U.S. patent application Ser. No. 12/408,121,entitled “ERROR COMPENSATION IN PHASE SHIFTING INTERFEROMETRY,” filed onMar. 20, 2009,can be used. The entire contents of bothUS-2008/0180679-A1 and U.S. Ser. No. 12/408,121 are incorporated hereinby reference.

The channels can be simultaneously sampled with an appropriate frequencyand phase relative to this modulation so that a new phase is obtainedonce each cycle. The phase variation is then converted into a physicallength variation by multiplying by λ/4π. The computational burden issmall at these rates and can easily be performed in real time with astandard microprocessor for all channels simultaneously.

During an interferometric measurement (e.g., SWLI or PUPS), the cavitymotion can read by the microprocessor controlling the interferometrysystem. The motion data can be used to either correct the scan motion ofthe interferometry system in real-time via a feedback mechanism, or timestamped to the interferometric data, saved and used during postprocessing of the interferometric data to correct for undesired scanmotions, for example, using the J-matrix method described herein.

While the embodiment of a sensor system described above in connectionwith FIG. 33A uses FSM's to vary the OPD in its internal cavity, otherconfigurations are also possible. For example, in some embodiments, asensor system can utilize an optical modulator (e.g., an electro-opticmodulator or acousto-optic modulator) in one or both paths of theinternal cavity in order to introduce a phase shift in the components ofthe light directed to the interferometric sensors.

An example of a sensor system that uses an optical modulator is shown inFIG. 33B. Here, a sensor system 5400 includes five modular subsystems:illumination module 5420, heterodyne module 5440, distribution module5460, sensors 5480, and detection and computation module 5490.Illumination module 5420, heterodyne module 5440, and distributionmodule 5460 generate, condition, and deliver light to each individualsensor via an optical fiber connection, and also receive light directedfrom the sensors back to distribution module 5460 via the optical fiber.The distribution module directs the returning light to the detection andcomputation module 5490, which detects the light and processes thecorresponding interference signals to determine information about themicroscope (or other system) that the sensors are arranged to monitor.Each sensor provides an independent axis of measurement, while thereference sensors generally provide additional information about thesystem that is used to improve the accuracy of the sensor measurements.

Illumination module 5420 includes a light source 5422 (e.g., anamplified spontaneous emission source (ASE)), a 1:4 optical switch 5424,three different bandpass filters 5426, 5428, and 5430, each centered ona different wavelength (λ₁, λ₂, and λ₃, respectively), and a second 1:4optical switch 5434. In addition, illumination module 5420 may includean amplitude modulator 5432. The bandpass filters 5426, 5428, and 5430and amplitude modulator 5432 are each connected in a separate parallelchannel between optical switches 5424 and 5434, which can be, e.g.,micro-electrical-mechanical (MEMS) switches. Using the three bandpassfilters, illumination module 5420 can provide output light over threenarrow wavelength ranges within the emission spectrum of light source5422, with amplitude modulator 5432 (if included) providing internalcalibration functions.

Generally, the transmission profile of bandpass filters 5426, 5428, and5430 are selected to provide a desired coherence length for the lightthat is directed to the sensors. In certain embodiments, bandpassfilters 5426, 5428, and 5430 have a full width at half maximum (FWHM) of1 nm or more (e.g., 2 nm or more, 3 nm or more, 5 nm or more, 10 nm ormore). Bandpass filters 5426, 5428, and 5430 can have a FWHM of 30 nm orless (e.g., 20 nm or less, 15 nm or less, 10 nm or less). In someembodiments, the filters provide light having a coherence length thatprovides signal contrast over an OPD range of about 1 mm or less (e.g.,about 800 μm or less, about 600 μm or less, about 400 μm or less).

In some embodiments, λ₁, λ₂, and λ₃ are selected to facilitate absolutedistance measurements (as opposed to simply detecting relativedisplacements), as described in more detail below.

Heterodyne module 5440 includes 50/50 fiber couplers 5442 and 5448,optical modulators 5440 and 5446, and optionally an optical delay line5450. The two paths form a remote cavity. Coupler 5442 receives lightfrom the illumination module and splits it along two parallel paths. Atleast one path includes an optical modulator (either 5440 or 5446) whichcan be, e.g., electro-optic modulators or acousto-optic modulators. Oneof the paths can include optical delay line 5450, which introducesadditional path length into that path, offsetting a nominal OPDintroduced by the sensor cavities. Optionally, each path can contain amodulator (5440 and 5446), e.g., in order to match the thermalsensitivities of the two legs.

In general, one optical modulator (5440 or 5446) is operated in a waythat introduces a controlled phase shift between the component of lightdirected along the two different paths of the internal cavity. Forexample, in some embodiments, the modulator is driven with a sawtoothsignal such that the amplitude of the phase modulation is an integermultiple N of 2π (e.g., Serrodyne modulation). When coupled seriallywith another cavity (i.e., from a sensor), and assuming the light isbroad-band, the Serrodyne OPD modulation produces interference at afrequency of N times the modulation frequency if the difference betweenthe OPDs of the two coupled cavities are within the coherence length.

The second modulator, aside from providing a passive thermal sensitivitymatching role, can also be modulated at a low frequency and used toperform cyclic phase error compensation in a manner described in U.S.Pat. No. 7,576,868 to Demarest (the entire contents of which isincorporated herein by reference), for example.

Distribution module 5460 performs the role of distributing the lightfrom heterodyne module 5440 to the individual sensors and referencecavities. Distribution module 5460 is composed of multiple 50/50 fibercouplers, connected to split the light coming from heterodyne module5440 into as many channels as necessary to supply the light to eachsensor and reference cavity. As shown in FIG. 33B, an initial 50/50coupler 5462 receives light from the heterodyne module and splits italong two parallel channels to 50/50 couplers 5464 and 5466, which inturn split the incoming light into two parallel channels respectively.Once split into sufficient channels, each channel is directed through a50/50 coupler (e.g., couplers 5468, 5470, 5472, and 5474 are shown inFIG. 33B) out to the sensors. These couplers both direct light to thesensors and direct light returning from each sensor to detection andcomputation module 5490.

As discussed previously, sensors 5480 include a number of individualmeasurement sensors (e.g., sensors 5482 and 5484) which are associated,e.g., with one or more microscopes, and additional reference sensors5486, 5488, and 5490. In general, the reference sensors are provided tomonitor various parameters associated with the sensor system, and theinformation obtained using the reference sensors is used to enhance theaccuracy of the sensor system in general. Examples of reference sensorsinclude refractometers (arranged to measure the refractive index of theatmosphere near to the sensors themselves or at other locations in thesystem) and wavemeters. Refractometers, for example, can be formed bycombining a sensor with an air-spaced etalon, such that variations ofthe phase measured using that sensor are attributable to changes in therefractive index of the air in the etalon cavity. Other referencesensors can also be provided using fixed length optical cavities (e.g.,etalons). For example, a reference sensor using a sealed etalon can beused to provide a reference phase for the system. A second referencesensor can utilize a fixed length cavity having a different cavitylength to provide information about wavelength variations in the lightused.

Generally, the reference sensors can be located close to the sensorsthemselves, or can be boxed with the other modules of the sensor system.

Detection and computation module 5490 includes a number of detectors5453, each connected to a 50/50 coupler in distribution module 5460 andarranged to receive light from a corresponding measurement sensor orreference sensor. Detectors 5453 are connected to a detection andamplification sub-module 5492, which receives a signal from eachdetector and amplifies the signal (e.g., a component of signal, such asthe AC component of the signal), and directs the amplified signal to ananalysis sub-module 5494 (e.g., an application specific integratedcircuit). Generally, the detection and computation module can be a standalone module, a module that is integrated with other modules in system5400, or a module that is integrated with other processing electronics(e.g., as part of a computer).

System 5400 operates to track incremental changes of the sensor cavityOPD's (e.g., corresponding to motion between a microscope objective anda test object) by monitoring changes in phase in the interference signalfrom each sensor relative to phase changes in the refractometer andwavelength meter, for example. This is done at a single wavelength(e.g., either λ₁, λ₂, or λ₃).

A variety of other operating modes can also be used to reduce variouserrors that can manifest in system measurements. For example,information about data age can be determined and applied to subsequentmeasurements. This can be achieved by measuring a relative phase offsetbetween each channel. This is equivalent to measuring the length of thefiber in each channel. This information can be obtained, for example, bymodulating the amplitude of the light source using amplitude modulator5432 while sweeping the amplitude modulation frequency over an operatingrange and measuring a relative phase offset for each channel todetermine a data age variation as a function of frequency. Subsequently,an appropriate correction can be applied to each channel whilemonitoring displacements with the sensors.

System 5400 can also be used to measure an absolute wavelength of theillumination source, accounting for variations in the spectralproperties of the source due to, e.g., thermal variations at each of thefilter wavelengths (i.e., λ₁, λ₂, and λ₃). Such measurements may beperformed, for example, by measuring the relative phase differencebetween two fixed reference cavities of different known path length. Theabsolute wavelength of each filter output can be determined based on thedifference between the phase measured using two fixed reference cavitiesof known, different cavity length values and refractive index of themedium filling the cavities.

System 5400 can also be used to measure the absolute cavity OPD in eachsensor. For example, sequentially, for each optical filter outputwavelength, a phase of light from each sensor is measured relative to afixed reference cavity. This provides three corresponding phases,φ_(λ1), φ_(λ2), and φ_(λ3), for each sensor. From these phases, thesystem calculates a wave order using phase differences (i.e.,Δφ_(λ1-λ2), Δφ_(λ2-λ3), Δφ_(λ3-λ1)) and the absolute wavelength for eachfilter's output (as discussed previously). The system then calculatesthe absolute OPD of each sensor cavity using the wave order and a singlephase for each cavity (e.g., φ_(λ1)) in a manner well known in the artas multi-wavelength interferometry.

In general, the OPD introduced by the internal cavity in heterodynemodule 5440 and the OPD introduced by each sensor cavity need to bewithin the coherence length of the light source in order to provide aninterference signal. Also, a source with a relatively short coherencelength is often desirable in order to eliminate coherence noise (e.g.,due to optical interfaces that are either the reference or test surfacesin the sensor). Generally, optical delay 5450 is selected to offset anominal sensor OPD so that at least certain components of the detectedlight have nominally zero OPD at the detectors. However, thisarrangement provides an interference signal only for small departures ofthe sensor OPD from the nominal sensor OPD (e.g., less than 1 mm).

In some embodiments, both a FSM and an optical modulator can be used toprovide appropriate range in cavity OPD and phase shifting propertiesfor accurate motion monitoring. For example, in certain embodiments,modulator 5446 is replaced with a FSM. A FSM can be utilized insituations where comparatively large OPD scans are required (e.g., onthe order of millimeters, e.g., about 1-10 mm). Such scans may berequired when using the sensor for autofocusing an objective, forexample. In situations where smaller phase shifts are sufficient (e.g.,where the heterodyne module OPD and the sensor OPD nominally offset eachother), phase shifting can be performed by an optical modulator instead.For example, where the sensor is used for vibration monitoring while thetest object remains at the same position with respect to the microscopeobjective, the optical modulator can be used.

In general, various types of interferometry objectives can be used incombination with a sensor system having a sensor forming a monitorcavity with a monitor surface during operation. In the following,several examples are described in which a sensor is mounted to aninterferometry objective such that the monitor cavity is formed usingthe test object examined with the interferometry objective.

As an enlarged view, FIG. 39 shows an objective unit 4540 as indicatedin FIG. 33 that includes Mirau objective 4167 and a sensor collar 4545.Mirau objective 4167 includes lenses 4550 and minors 4560 that provide atest optical path and a reference optical path for the interferometricmeasurement. Sensor collar 4545 includes sensors 4099A and 4099B thatare connected, for example, via fibers 4012 to subsystem 4010 as shownin FIG. 33. Sensors 4099A and 4099B emit radiation perpendicular ontotest object 4175, thereby forming a monitor cavity with the surface ofthe test object at regions that are not within the field-of-view ofMirau objective 4167.

FIG. 40 illustrates the combination of a sensor 4570 with a Michelsonobjective 4580. Sensor 4570 irradiates test object 4175 via a beamsplitter 4585 essentially within the field-of-view of Michelsonobjective 4580.

FIG. 41 illustrates the implementation of two sensors 4590A and 4590Bwithin a Linnik objective 4592. Linnik objective 4592 includesSchwarzschild optics 4594A and 4594B. Optional polarizers P in each of atest leg 4596A and in reference leg 4596B are shown for a polarizedLinnik, and would be absent in an unpolarized version. Sensors 4590A and4590B are positioned in the center part of Linnik objective 4592. Sensor4590A irradiates test object 4175, within the field-of-view of Linnikobjective 4592, thereby forming a first monitor cavity with the surfaceof test object 4175. Similarly, sensor 4590B irradiates reference object4181, thereby forming a second monitor cavity with the surface ofreference object 4181. As indicated, reference object 4181 isdisplaceable for providing the phase shift for, e.g., an interferometricSWLI measurement.

As described above, sensor systems can be implemented in various waysdepending on interferometric objective used. Moreover, sensor systemscan be implemented in various ways depending on the scanning modes usedfor the interferometric measurement. For example, one distinguishesbetween focus scanning and path-length scanning depending on whether thefocus is being scanned or the path length is scanned while maintainingthe focus position.

In focus scanning, the position of the focal plane of interferenceobjective relative to test surface is varied, typically by moving theobjective as a whole. Focus scanning can be used with interferometricobjectives whose reference surface is inaccessible—such as, for example,Mirau-type objectives.

In path-length scanning the reference surface is moved (e.g., itsposition is sinusoidal modulated) while the focal plane is fixed.Path-length scanning can be used with Linnik or Michelson objectiveswhere the reference surface can be accessed and SWLI and PUPSinterferometry can be performed.

As examples suited for focus-scanning, FIGS. 42A-42C showimplementations of sensors with a generic objective 4600. Though onesensor is shown in FIGS. 42A-42C as well in most of the followingfigures, more than one sensor can be employed for redundancy or toprovide angular motion information.

In FIG. 42A, a sensor 4610 is buried in a stage 4620 holding the testobject and monitors the motion of generic objective 4600 relative tostage 4620. In FIG. 42B, a sensor 4630 is attached to generic objective4600 and monitors the motion of generic objective 4600 relative to stage4620 (if a surface part of the stage forms the monitor cavity) ordirectly to test object (if a surface part of the test object forms themonitor cavity). In FIG. 42C, a sensor 4640 is mounted to genericobjective 4600 such that it emits a sensor beam 4650 that reflectsobliquely off stage 4620 or the test surface and is then reflected backto sensor 4640 from a minor 4660 mounted on the other side of genericobjective 4600. The configuration of FIG. 42C can reduce Abbé errorswhen sensor beam 4650 reflects from a measurement point 4670 of genericobjective 4600 (as indicated in FIG. 42C) but can have a reducedvertical motion sensitivity.

Michelson and Linnik objectives allow particularly simple sensorconfigurations for focus scanning that reduce Abbé errors withoutcompromising vertical sensitivity by using optics of the Michelson andLinnik objectives for defining the optical path of the sensor beam.

For example, the combination of a Michelson objective with sensor 4570shown in FIG. 43A corresponds to the configuration shown in FIG. 41, inwhich a sensor beam 4680 of sensor 4570 is reflected by beam splitter4585 orthogonally onto test object 4175. Sensor 4570 can include abuilt-in reference as described, for example, in connection with FIG. 34to provide an interferometric cavity.

In contrast to the configuration shown in FIG. 43A, the configurationshown in FIG. 43B can be operated with a sensor 4570A that does notprovide a built-in reference because a reference leg 4686 of theMichelson objective provides a reference object 4688 that is used alsoas reference for sensor 4570A. Specifically, the interaction of beamsplitter 4585 with sensor beam 4680 is configured such that a referencebeam 4690 is transmitted to and reflected back from reference object4688. Beam splitter 4585 can be based, for example, on polarizationstate or wavelength splitting.

As another example, the combination of a Linnik objective with a sensor4700 and lens based test objective 4715 and lens based referenceobjective 4718 is shown in FIG. 43C. As in FIG. 43A, a sensor beam 4710of sensor 4700 is reflected by beam splitter 4720 orthogonally onto testobject 4175. Sensor 4700 can include a built-in reference as described,for example, in connection with FIG. 34 to provide an interferometriccavity.

In contrast to the configuration shown in FIG. 43C, the configurationshown in FIG. 43D can be operated with a sensor 4700A that does notprovide a built-in reference because a reference leg 4730 of the Linnikobjective provides a reference object 4740 that is used also asreference for sensor 4700A. Specifically, the interaction of beamsplitter 4720 with sensor beam 4710 is configured such that a referencebeam 4750 is transmitted to and reflected back from reference object4740. Beam splitter 4720 can be based, for example, on polarizationstate or wavelength splitting.

While FIGS. 43A-43D were described as configurations being used withfocus scanning, in certain embodiments sensor systems can be combinedwith interferometry systems that operate with path-length scanning. Inpath-length scanning, the objective reference surface rather than thetarget surface is scanned to vary the OPD during the interferometricmeasurement.

For example as shown in FIG. 44A, a Michelson objective can be combinedwith a sensor 4800 that forms a monitor cavity with the surface of theback side of reference object 4810. A sensor beam 4820 of sensor 4800reflected back by reference object 4810 is sensitive to motion ofreference object 4810 and can be used to correct for motion errors butnot for autofocus sing. Sensor 4800 can include a built-in reference asdescribed, for example, in connection with FIG. 34 to provide aninterferometric cavity.

As another example, the combination of a Linnik objective with a sensor4830 is shown in FIG. 44B. As in FIG. 44A, a sensor beam 4840 of sensor4830 is reflected by reference object 4686. Also sensor 4830 can includea built-in reference as described, for example, in connection with FIG.34 to provide an interferometric cavity.

As examples using sensors without a built-in reference, theconfigurations as described in connection with FIGS. 43B and 43D can beused in path-length scanning. Then instead of scanning, e.g., testobject 4175 or Linnik test objective 4715 in the test leg, one maintainsthe focus position in the test leg and varies in FIG. 43B the positionof reference object 4688 and in FIG. 43D the position of referenceobject 4740, Linnik reference objective 4740, or both (e.g.,synchronously).

In certain applications, one scans the reference surface and targetsurface simultaneously. Then, one can use the sensor system to monitorboth motions simultaneously. Moreover, additional degrees of freedom canalso be monitored, such as a reference surface tilt, which can beuseful, for example, for PUPS applications.

Monitoring two or more motions simultaneously can be performed with twoor more separate sensors that, for example, are connected to separatechannels of subsystem 4010 as described in connection with FIG. 33.Examples how two or more sensors can be positioned at a Michelson or aLinnik interferometer are shown in FIGS. 45A-45C.

FIG. 45A is a combination of the embodiments shown in FIGS. 42B and 44Ain which a first sensor 4630A mounted to the Michelson objectivemonitors the motion of test object 4175 relative to the Michelsonobjective while a second sensor 4800A monitors the motion of referenceobject 4686.

FIG. 45B is a combination of the embodiments shown in FIGS. 42B and 44Bin which a first sensor 4630B mounted to the Linnik test objective 4715monitors the motion of test object 4175 relative to the Linnik objectivewhile a second sensor 4830B monitors the motion of reference object4740.

FIG. 45C shows a configuration similar to the configuration shown inFIG. 45B in which additionally to the motion of reference object 4740the tilt and piston of the reference surface of reference object 4740are monitored with two sensors 4830C and 4830D. FIG. 46 shows anembodiment where a sensor 4800 monitors the motion of a scanner 4810directly, rather than monitoring the interferometric cavity. Monitoringscanner 4810 can be performed if scanner 4810 was the largest source ofmotion uncertainty and thus can enable the use of more imprecise andinexpensive scanning mechanisms.

FIG. 47 shows an embodiment that can allow monitoring an interferometriccavity in the case that a test surfaces 4820 of test object 4175 is toosmall to be directly accessed with an off-axis sensor 4830, or in thecase that test surfaces 4820 of test object 4175 has a surface slopethat does not provide a reliable return signal to sensor 4830. In thiscase, test object 4175 is mounted to a special parts stage 4840 having amirror 4850 that sensor 4830 looks at. The mirror surface is mountedsuch that its surface height corresponds to the expected surface heightof test object 4175. This configuration can, for example, applied inassembly line applications, where the test objects are very similar.FIGS. 48A and 48B show configurations incorporating an objective turret4900 with a rotating part 4940 and a non-rotating part 4930. Turrets canbe used in microscope applications for providing different types ofobjectives 4910A and 4910B with, for example, specific magnifications tothe measurement. In FIG. 48A, each objective 4910A and 4910B has its ownattached sensor 4920A and 4920B, while in FIG. 48B a single sensor 4920Cis attached to non-rotating part 4940 of turret 4900. The configurationshown in FIG. 48A is not or at least less influenced by unanticipatedmotion in the mechanical linkage between rotating part 4940 andnon-rotating part 4930 of turret 4900 because the motion in themechanical linkage is at least in principle considered by sensors 4920Aand 4920B. However, the configuration shown in FIG. 48B can require asmaller number of sensors and does not need to be concerned aboutwinding the return fibers as turret 4900 is rotated.

In some embodiments, a single sensor system can be used to monitormultiple microscopes. For example, referring to FIG. 53, a system 5300includes three microscopes 5310, 5320, and 5330, each having associatedwith it an interferometric sensor. Specifically, sensor 5312 isassociated with microscope 5310, sensor 5322 is associated withmicroscope 5320, and sensor 5332 is associated with microscope 5330.

Microscope 5310 is arranged to observe a test object 5311 supported by astage 5314. Similarly, microscope 5320 is arranged to observe adifferent test object 5321, supported on a different stage 5324, andmicroscope 5330 is arranged to observe a third test object 5331supported on a third stage 5334.

Various components of the sensor system are housed in a module 5340 thatis located remote from sensors 5312, 5322, and 5332. For example, thesensor system light source, light distribution module, remote cavity,and detection and phase meter electronics can be housed in module 5340.In general, the only connection between module 5340 and the sensors canbe optical fibers, which deliver light from a distribution module to thesensors and deliver light from the sensors back to the detection andphase meter electronics housed in module 5340, for example.

In general, sensors 5312, 5322, and 5332 can be associated with theircorresponding microscopes in a variety of ways. In general, thisassociation means they are configured to provide information about atleast one degree of freedom between the test object and thecorresponding microscope. For example, the sensors can be mounted on orclose to the microscope objective and can have an associated opticmounted on or close to the corresponding test object (e.g., attached tothe corresponding stage). Examples of such configurations are discussedabove.

Moreover, while FIG. 53 depicts the sensors as being attached to thecorresponding microscope (as opposed to the stage), other configurationsare also possible. For example, in some embodiments the sensors can bephysically attached to the stage and include an optic that is attachedto the microscope.

In general, a variety of different types of test object can be examinedusing system 5300. For example, in some embodiments, the test objectsare substrates for flat panel displays (e.g., display substrates thatsupport thin-film transistor (TFT) or other integrated circuitcomponents). In certain embodiments, the test objects are semiconductorwafers.

In some embodiments, one or more of microscopes 5310, 5320, and 5330 canbe arranged to examine the same test object. For example, two or moremicroscopes can be configured to examine different portions of asubstrate (e.g., a display substrate).

Of course, while system 5300 includes only three microscopes, ingeneral, a single sensor system can be used to monitor any number ofmicroscopes (e.g., 4 or more, 5 or more, 6 or more, 8 or more, 10 ormore). Furthermore, while each microscope is shown having just onesensor associated therewith, in general, more than one sensor can beassociated with a single microscope. For example, in some embodiments,microscopes can include multiple objectives. In such embodiments, eachobjective can include an associated sensor (e.g., as shown in FIG. 33).

Alternative Embodiments

While the source sub-system in some of the described embodiments includeprimary source 163 and a secondary source 197, other configurations arealso possible. In general, the wavelength of light from secondary source197 can vary as desired, provided the wavelength(s) is detectable bysecondary detector 199. The chosen wavelength may be within thebandwidth of primary source 163, or at an entirely different wavelength.For example, primary source 163 may be selected to provide white,visible-wavelength light; while secondary source 197 provide light thatis in the UV or the IR portions of the spectrum. Furthermore, secondarysource 197 may provide light at a series of discrete wavelengths, eithertogether or in sequence.

Moreover, in some embodiments, the source sub-system includes a singlesource, rather than separate primary and secondary sources. The singlesource produces both the radiation for primary detector 191 and theradiation for secondary detector 199. For example, filter 101 that isused in conjunction with secondary detector 199 can be selected to passa single wavelength (or narrow wavelength band) from the source tosecondary detector 199.

In general, secondary source 197 may be extended or a point source, andthe secondary source imaging may be Koehler or critical. Generally, whenusing a point source with PUPS, critical illumination is preferred so asto illuminate the pupil; while for SWLI, Koehler illumination isgenerally preferred so as to illuminate a large area of the part.

Primary source 163 may be an LED, an arc lamp, an incandescent lamp, awhite-light laser, or any other source suitable for broadbandinterferometry.

In embodiments, an aperture stop may be used to control the spatialextent of the light source. An intermediate-plane illumination is alsofeasible.

Various configurations of the detector sub-system are also possible. Forexample, secondary detector 199 generically may be described as adetector with a minimum of two detection points or pixels. Thus,secondary detector 199 can be a single detector with integrated detectorelements (as shown in the described embodiments), or may be composed ofmultiple, discrete single-element detectors.

In some embodiments, a single detector can be used in place of primarydetector 191 and secondary detector 199. For example, primary detector191 can include several detector elements devoted to the task ofacquiring monitor signals. This may include, for example, includingseparate narrow-band filters in front of the corresponding detectorelements, or may include optics selected so as to direct the light forthe monitor signals to specific element of primary detector 191.

Various ways of introducing phase diversity between the monitor signalshas been discussed. Other ways of achieving this are also possible. Forexample, in addition to introducing a relative tilt between thereference and measurement light to introduce fringes across the FOV ofsecondary detector 199, additional optical elements can be used toachieve the same effect. For example, in some embodiments, polarizationelements to can be used to shift phase across the light at detector 199.This includes, for example, the limit case of a single measurement pointwith polarizing elements to generate relative phase shifts between themeasurement and reference beams.

In the described embodiments, the detector and source sub-systems areincorporate both the primary and secondary detectors and sources,respectively. Other embodiments are also possible. For example, in someembodiments, the secondary source and detector are bundled together intoa separate sub-system sharing some of the optics of the primary system.For example, the secondary source and detector may be packaged togetherinto a module that fits between the primary detector and the rest of thesystem, or between the objective and the rest of the system.

Further, while the foregoing discussion assumes that the scan profile isnominally linear in time, the scan error correction techniques can beapplied to other scan profiles too.

While the embodiments disclosed above feature interference microscopeshaving either Linnik or Mirau objectives, the techniques for scan errorproduction can be implemented using other types of interferencemicroscopes as well (e.g., microscopes using Michelson interferometers).More generally, the techniques are not limited to use in interferencemicroscopes, and can be implemented using non-microscope interferometersas well.

Computer Program

Any of the computer analysis methods described above can be implementedin hardware or a combination of both. The methods can be implemented incomputer programs using standard programming techniques following themethod and figures described herein. Program code is applied to inputdata to perform the functions described herein and generate outputinformation. The output information is applied to one or more outputdevices such as a display monitor. Each program may be implemented in ahigh level procedural or object oriented programming language tocommunicate with a computer system. However, the programs can beimplemented in assembly or machine language, if desired. In any case,the language can be a compiled or interpreted language. Moreover, theprogram can run on dedicated integrated circuits preprogrammed for thatpurpose.

Each such computer program is preferably stored on a storage medium ordevice (e.g., ROM or magnetic diskette) readable by a general or specialpurpose programmable computer, for configuring and operating thecomputer when the storage media or device is read by the computer toperform the procedures described herein. The computer program can alsoreside in cache or main memory during program execution. The analysismethod can also be implemented as a computer-readable storage medium,configured with a computer program, where the storage medium soconfigured causes a computer to operate in a specific and predefinedmanner to perform the functions described herein.

Embodiments relate to interferometry systems and methods for determininginformation about a test object. Additional information about suitablelow-coherence interferometry systems, electronic processing systems,software, and related processing algorithms is disclosed in commonlyowed U.S. Patent Applications published as US-2005-0078318-A1 entitled“METHODS AND SYSTEMS FOR INTERFEROMETRIC ANALYSIS OF SURFACES ANDRELATED APPLICATIONS,” US-2004-0189999-A1 entitled “PROFILING COMPLEXSURFACE STRUCTURES USING SCANNING INTERFEROMETRY,” andUS-2004-0085544-A1 entitled “INTERFEROMETRY METHOD FOR ELLIPSOMETRY,REFLECTOMETRY, AND SCATTEROMETRY MEASUREMENTS, INCLUDINGCHARACTERIZATION OF THIN FILM STRUCTURES,” the contents of which areincorporated herein by reference.

Exemplary Applications

The low coherence interferometry methods and systems incorporating scanerror correction described above may used for any of the followingsurface analysis problems: simple thin films; multilayer thin films;sharp edges and surface features that diffract or otherwise generatecomplex interference effects; unresolved surface roughness; unresolvedsurface features, for example, a sub-wavelength width groove on anotherwise smooth surface; dissimilar materials; polarization-dependentproperties of the surface; and deflections, vibrations or motions of thesurface or deformable surface features that result in incident-angledependent perturbations of the interference phenomenon. For the case ofthin films, the variable parameter of interest may be the filmthickness, the refractive index of the film, the refractive index of thesubstrate, or some combination thereof. Exemplary applications includingobjects and devices exhibit such features are discussed next.

Semiconductor Processing

The systems and methods described above can be used in a semiconductorprocess for tool specific monitoring or for controlling the process flowitself. In the process monitoring application, single/multi-layer filmsare grown, deposited, polished, or etched away on unpatterned Si wafers(monitor wafers) by the corresponding process tool and subsequently thethickness and/or optical properties are measured using theinterferometry system employing the scan error correction techniquedisclosed herein. The average, as well as within wafer uniformity, ofthickness (and/or optical properties) of these monitor wafers are usedto determine whether the associated process tool is operating withtargeted specification or should be retargeted, adjusted, or taken outof production use.

In the process control application, latter single/multi-layer films aregrown, deposited, polished, or etched away on patterned Si, productionwafers by the corresponding process tool and subsequently the thicknessand/or optical properties are measured with the interferometry systememploying the scan error correction technique disclosed herein.Production measurements used for process control typical include a smallmeasurement site and the ability to align the measurement tool to thesample region of interest. This site may consists of multi-layer filmstack (that may itself be patterned) and thus requires complexmathematical modeling in order to extract the relevant physicalparameters. Process control measurements determine the stability of theintegrated process flow and determine whether the integrated processingshould continue, be retargeted, redirected to other equipment, or shutdown entirely.

Specifically, for example, the interferometry systems disclosed hereincan be used to monitor the following equipment: diffusion, rapid thermalanneal, chemical vapor deposition tools (both low pressure and highpressure), dielectric etch, chemical mechanical polishers, plasmadeposition, plasma etch, lithography track, and lithography exposuretools. Additionally, the interferometry system disclosed herein can beused to control the following processes: trench and isolation,transistor formation, as well as interlayer dielectric formation (suchas dual damascene).

Copper Interconnect Structures and Chemical Mechanical Polishing

It is becoming common among chip makers to use the so-called ‘dualdamascene copper’ process to fabricate electrical interconnects betweendifferent parts of a chip. This is an example of a process which may beeffectively characterized using a suitable surface topography system.The dual damascene process may be considered to have six parts: (1) aninterlayer dielectric (ILD) deposition, in which a layer of dielectricmaterial (such as a polymer, or glass) is deposited onto the surface ofa wafer (containing a plurality of individual chips); (2) chemicalmechanical polishing (CMP), in which the dielectric layer is polished soas to create a smooth surface, suitable for precision opticallithography, (3) a combination of lithographic patterning and reactiveion etching steps, in which a complex network is created comprisingnarrow trenches running parallel to the wafer surface and small viasrunning from the bottom of the trenches to a lower (previously defined)electrically conducting layer, (4) a combination of metal depositionsteps which result in the deposition of copper trenches and vias, (5) adielectric deposition step in which a dielectric is applied over thecopper trenches and vias, and (6) a final CMP step in which the excesscopper is removed, leaving a network of copper filled trenches (andpossibly vias) surrounded by dielectric material.

Referring to FIG. 20A, a device 500 is exemplary of the film structureresulting from the deposition of a dielectric 504 over copper features502 deposited on a substrate 501. The dielectric 504 has a non-uniformouter surface 506 exhibiting height variations therealong. Interferencesignals obtained from device 500 can include interference patternsresulting from surface 506, an interface 508 between copper features 502and dielectric 504, and an interface 510 between substrate 501 anddielectric 504. The device 500 may include a plurality of other featuresthat also generate interference patterns.

Referring to FIG. 20B, a device 500′ illustrates the state of device 500after the final CMP step. The upper surface 506 has been planarized to asurface 506′, and interface 508 may now be exposed to the surroundings.Interface 510 at the substrate surface remains intact. Deviceperformance and uniformity depends critically on monitoring theplanarization of surface 504. It is important to appreciate that thepolishing rate, and therefore the remaining copper (and dielectric)thickness after polishing, depends strongly and in a complex manner onthe polishing conditions (such as the pad pressure and polishing slurrycomposition), as well as on the local detailed arrangement (i.e.,orientation, proximity and shape) of copper and surrounding dielectricregions. Hence, portions of surface 506 over copper elements 502 mayetch at different rates than other portions of surface 506.Additionally, once interface 508 of copper elements 502 is exposed, thedielectric and copper elements may exhibit different etch rates.

This ‘position dependent polishing rate’ is known to give rise tovariable surface topography on many lateral length scales. For example,it may mean that chips located closer to the edge of a wafer onaggregate are polished more rapidly than those located close to thecenter, creating copper regions which are thinner than desired near theedges, and thicker than desired at the center. This is an example of a‘wafer scale’ process nonuniformity—i.e., one occurring on length scalecomparable to the wafer diameter. It is also known that regions whichhave a high density of copper trenches polish at a higher rate thannearby regions with low copper line densities. This leads to aphenomenon known as ‘CMP induced erosion’ in the high copper densityregions. This is an example of a ‘chip scale’ processnon-uniformity—i.e., one occurring on a length scale comparable to (andsometimes much less than) the linear dimensions of a single chip.Another type of chip scale nonuniformity, known as ‘dishing’, occurswithin single copper filled trench regions (which tend to polish at ahigher rate than the surrounding dielectric material). For trenchesgreater than a few microns in width dishing may become severe with theresult that affected lines later exhibit excessive electricalresistance, leading to a chip failure.

CMP induced wafer and chip scale process nonuniformities are inherentlydifficult to predict, and they are subject to change over time asconditions within the CMP processing system evolve. To effectivelymonitor, and suitably adjust the process conditions for the purpose ofensuring that any nonuniformities remain within acceptable limits, it isimportant for process engineers to make frequent non-contact surfacetopography measurements on chips at a large number and wide variety oflocations. This is possible using embodiments of the interferometrymethods and systems described above.

In some embodiments one or more spatial properties, e.g., the topographyof surface 506 and/or the thickness of dielectric 504, are monitored byobtaining low coherence interference signals from the structure beforeand/or during CMP. Based on the spatial properties, the polishingconditions can be changed to achieve the desired planar surface 506′.For example, the pad pressure, pad pressure distribution, polishingagent characteristics, solvent composition and flow, and otherconditions can be determined based on the spatial properties. After someperiod of polishing, the spatial property can again be determined andthe polishing conditions changed as needed. The topography and/orthickness is also indicative of the end-point at which, e.g., surface504′ is achieved. Thus, the low coherence interference signals can beused to avoid depressions caused by over polishing different regions ofthe object. The low coherence interference methods and systems areadvantageous in this respect because spatial properties of the device,e.g., the relative heights of the surface of the dielectric (a) overcopper elements 502 and (b) over substrate surface 510 but adjacentcopper elements 502 can be determined even in the presence of themultiple interfaces.

Photolithography

In many microelectronics applications, photolithography is used topattern a layer of photoresist overlying a substrate, e.g., a siliconwafer. Referring to FIGS. 20A and 20B, an object 30 includes asubstrate, e.g., a wafer, 32 and an overlying layer, e.g., photoresistlayer 34. Object 30 includes a plurality of interfaces as occur betweenmaterials of different refractive index. For example, anobject-surroundings interface 38 is defined where an outer surface 39 ofphotoresist layer 34 contacts the environment surrounding object 30,e.g., liquid, air, other gas, or vacuum. A substrate-layer interface 36is defined between a surface 35 of wafer 32 and a bottom surface 37 ofphotoresist layer 34. Surface 35 of the wafer may include a plurality ofpatterned features 29. Some of these features have the same height asadjacent portions of the substrate but a different refractive index.Other features may extend upward or downward relative to adjacentportions of the substrate. Accordingly, interface 36 may exhibit acomplex, varying topography underlying the outer surface of thephotoresist.

A photolithography apparatus images a pattern onto the object. Forexample, the pattern may correspond with elements of an electroniccircuit (or the negative of the circuit). After imaging, portions of thephotoresist are removed revealing the substrate underlying the removedphotoresist. The revealed substrate can be etched, covered withdeposited material, or otherwise modified. Remaining photoresistprotects other portions of the substrate from such modification.

To increase manufacturing efficiencies, more than one device issometimes prepared from a single wafer. The devices may be the same ordifferent. Each device requires that a subset of the wafer be imagedwith a pattern. In some cases, the pattern is sequentially imaged ontodifferent subsets. Sequential imaging can be performed for severalreasons. Optical aberrations can prevent achieving adequate patternfocus quality over larger areas of the wafer. Even in the absence ofoptical aberrations, the spatial properties of the wafer and photoresistmay also prevent achieving adequate pattern focus over large areas ofthe wafer. Aspects of the relationship between the spatial properties ofthe wafer/resist and focus quality are discussed next.

Referring back to FIG. 20B, object 30 is shown with a number N subsets40 _(i), each smaller than a total area 41 the object to be imaged.Within each subset 40 _(i), spatial property variations, e.g., heightand slope variations of the wafer or photoresist, are typically smallerthan when taken over the total area 41. Nonetheless, the wafer orphotoresist of different subsets 40, typically have different heightsand slopes. For example, layer 34 exhibits thicknesses Δt₁ and Δt₂,which vary the height and slope of surface 39. Thus, each subset of theobject may have a different spatial relationship with thephotolithography imager. The quality of focus is related to the spatialrelationship, e.g., the distance between the object and thephotolithography imager. Bringing different subsets of the object intoproper focus may require relative repositioning of the object andimager. Because of the object height and slope variations, proper subsetfocus cannot be achieved solely by determining the position andorientation of the object with respect to a portion of the object thatis remote to the imaged subset, e.g., a side 43 of the object.

Proper focus can be achieved by determining a spatial property of anobject within a subset of the object to be imaged (or otherwiseprocessed). Once the position of the subset has been determined, theobject (and/or a portion of the photolithography imager) can be moved,e.g., translated, rotated, and/or tilted, to modify the position of thesubset with respect to a reference, e.g., a portion of thephotolithography imager. The determination and movement (if necessary)can be repeated for each subset to be imaged.

The determination of the spatial property of the subset can includedetermining a position and/or height of one or more points of an outersurface of a thin layer of the object, the one or more points lyingwithin the subset of the object to be imaged. For example, the positionand orientation of the outer surface 39 of subset 40 ₂ (FIG. 20A) can bedetermined based upon the positions of points 42 ₁-42 ₃ within thesubset. The determination of the spatial property of the subset to beimaged can include using an interferometer to illuminate the subset withlight and detecting an interference signal including light reflectedfrom the illuminated subset. In some embodiments, a plurality of subsetsare simultaneously imaged with light to obtain a plurality ofinterference signals. Each interference signal is indicative of one ormore spatial properties of a subset. Thus, the interference signals canbe used to prepare an image indicative of the topography of the objectover a plurality of the subsets. During photolithography of the subsets,the wafer is positioned based upon the topography of the individualsubsets as determined from the plurality of interference signals. Hence,each subset can be positioned for optimum focus with respect to thephotolithography apparatus.

Detecting an interference signal from each subset of an object to beimaged can include detecting light reflected from the subset andreference light over an OPD range that is at least as large as acoherence length of the detected light. For example, the light may bedetected at least over its coherence length. In some embodiments, theinterferometer is configured so that the light reflected from theilluminated subset is dominated by light reflected from either an outerinterface (such as outer surface 39) or an inner interface (such asinterface 36). In some embodiments, a spatial property of an object isdetermined based on only a portion of the interference signal. Forexample, if the interference signal includes two or more overlappinginterference patterns, a spatial property of the object can bedetermined based upon a portion of one of the interference patterns thatis dominated by contributions from a single interface of the object.

Solder Bump Processing

Referring to FIGS. 21A and 21B, a structure 1050 is exemplary of astructure produced during solder bump processing. Structure 1050includes a substrate 1051, regions 1002 non-wettable by solder, and aregion 1003 wettable by solder. Regions 1002 have an outer surface 1007.Region 1003 has an outer surface 1009. Accordingly, an interface 1005 isformed between regions 1002 and substrate 1001.

During processing a mass of solder 1004 is positioned in contact withwettable region 1003. Upon flowing the solder, the solder forms a securecontact with the wettable region 1003. Adjacent non-wettable regions1002 act like a dam preventing the flowed solder from undesirablemigration about the structure. It is desirable to know spatialproperties of the structure including the relative heights of surfaces1007, 1009 and the dimensions of solder 1004 relative to surface 1002.As can be determined from other discussions herein, structure 1050includes a plurality of interfaces that may each result in aninterference pattern. Overlap between the interference patterns preventsaccurate determinate of the spatial properties using known interferencetechniques. Application of the systems and methods discussed hereinallow the spatial properties to be determined.

Spatial properties determined from structure 1050 can be used to changemanufacturing conditions, such as deposition times for layers 1002,1003and the amount of solder 1004 used per area of region 1003.Additionally, heating conditions used to flow the solder can also bechanged based on the spatial properties to achieve adequate flow and orprevent migration of the solder.

Flat Panel Displays

The interferometry systems and methods disclosed herein can be used inthe manufacture of flat panel displays such as, for example, liquidcrystal displays (LCDs).

In general, a variety of different types of LCDs are used in manydifferent applications, such as LCD televisions, desktop computermonitors, notebook computers, cell phones, automobile GPS navigationsystems, automobile and aircraft entertainment systems to name a few.While the specific structure of LCDs can vary, many types of LCD utilizea similar panel structure. Referring to FIG. 23A, for example, in someembodiments, a LCD panel 450 is composed of several layers including twoglass plates 452,453 connected by an edge seal 454. Glass plates 452 and453 are separated by a gap 464, which is filled with a liquid crystalmaterial. Polarizers 456 and 474 are applied to the outer surfaces ofglass plates 453 and 452, respectively. When integrated into a LCD, oneof the polarizers operates to polarize light from the display's lightsource (e.g., a backlight, not shown) and the other polarizer serves asan analyzer, transmitting only that component of the light polarizedparallel to the polarizer's transmission axis.

An array of color filters 476 is formed on glass plate 453 and apatterned electrode layer 458 is formed on color filters 476 from atransparent conductor, commonly Indium Tin Oxide (ITO). A passivationlayer 460, sometimes called hard coat layer, commonly based on SiOx iscoated over the electrode layer 458 to electrically insulate thesurface. An alignment layer 462 (e.g., a polyimide layer) is disposedover the passivation layer 460 to align the liquid crystal material ingap 464.

Panel 450 also includes a second electrode layer 472 formed on glassplate 452. Another hard coat layer 470 is formed on electrode layer 472and another alignment layer 468 is disposed on hard coat layer 470. Inactive matrix LCDs (AM LCDs), one of the electrode layers generallyincludes an array of thin film transistors (TFTs) (e.g., one or more foreach sub-pixel) or other integrated circuit structures.

The liquid crystal material is birefringent and modifies thepolarization direction of light propagating through the LCD panel. Theliquid crystal material also has a dielectric anisotropy and istherefore sensitive to electric fields applied across gap 464.Accordingly, the liquid crystal molecules change orientation when anelectric field is applied, thereby varying the optical properties of thepanel. By harnessing the birefringence and dielectric anisotropy of theliquid crystal material, one can control the amount of light transmittedby the panel.

The cell gap Δg, i.e., thickness of the liquid crystal material, isdetermined by spacers 466, which keep the two glass plates 452,453 at afixed distance. In general, spacers can be in the form of preformedcylindrical or spherical particles having a diameter equal to thedesired cell gap or can be formed on the substrate using patterningtechniques (e.g., conventional photolithography techniques). The cellgap affects both the amount of optical retardation of light traversingthe panel and the viscoelastic response of molecular alignment of theliquid crystal material, and therefore an important parameter toaccurately control in LCD panel manufacturing.

In general, LCD panel manufacturing involves multiple process steps informing the various layers. For example, referring to FIG. 23B, aprocess 499 includes forming the various layers on each glass plate inparallel, and then bonding the plates to form a cell. As illustrated,initially, TFT electrodes are formed (step 499A1) on a first glassplate. A passivation layer is formed (step 499A2) over the TFTelectrodes, and then an alignment layer is formed (step 499A3) over thepassivation layer. Next, spacers are deposited (step 499A4) on thealignment layer. Processing of the second glass plate typically involvesforming color filters (step 499B1) and forming a passivation layer overthe color filters (step 499C1). Then, electrodes (e.g., commonelectrodes) are formed (step 499B3) on the passivation layer, and analignment layer is then formed (step 499B4) on the electrodes.

The cell is then formed by bonding the first and second glass platestogether (step 499C1), and the cell is then filled with the liquidcrystal material and sealed (step 499C2). After sealing, the polarizersare applied to the outer surface of each of the glass plates (step499C3), providing the completed LCD panel. The combination and orderingof the steps shown in the flow chart are illustrative and, in general,other step combinations and their relative ordering can vary.

Furthermore, each step illustrated in the flow chart in FIG. 23B caninclude multiple process steps. For example, forming the TFT electrodes(commonly referred to as “pixel electrodes”) on the first glass plateinvolves many different process steps. Similarly, forming the colorfilters on the second glass plate can involve numerous process steps.Typically, forming pixel electrodes, for example, includes multipleprocess steps to form the TFTs, ITO electrodes, and various bus lines tothe TFTs. In fact, forming the TFT electrode layer is, in essence,forming a large integrated circuit and involves many of the samedeposition and photolithographic patterning processing steps used inconventional integrated circuit manufacturing. For example, variousparts of the TFT electrode layer are built by first depositing a layerof material (e.g., a semiconductor, conductor, or dielectric), forming alayer of photoresist over the layer of material, and exposing thephotoresist to patterned radiation. The photoresist layer is thendeveloped, which results in a patterned layer of the photoresist. Next,portions of the layer of material lying beneath the patternedphotoresist layer are removed in a etching process, thereby transferringthe pattern in the photoresist to the layer of material. Finally, theresidual photoresist is stripped from the substrate, leaving behind thepatterned layer of material. These process steps can be repeated manytimes to lay down the different components of the TFT electrode layer,and similar deposition and patterning steps are often used to form colorfilters as well.

In general, the interferometry techniques disclosed herein can be usedto monitor production of LCD panels at a variety of different stages oftheir production. For example, the interferometry techniques can be usedto monitor the thickness and/or uniformity of photoresist layers usedduring LCD panel production. As explained previously, photoresist layersare used in lithographic patterning of TFT components and color filters,for example. For certain process steps, a layer of photoresist can bestudied using a low coherence interferometry system prior to exposingthe photoresist to patterned radiation. The low coherence interferometrysystems can measure a thickness profile of the photoresist layer at oneor more locations of the glass plate. Alternatively, or additionally,the techniques can be used to determine a surface profile of thephotoresist layer. In either case, where the measured photoresist layercharacteristics is within specified tolerance windows, the photoresistlayer can be exposed to the desired patterned radiation. Where thephotoresist layer is not within the specified window, it can be strippedfrom the glass plate and a new photoresist layer deposited.

In some embodiments, the interferometry techniques are used to monitorcharacteristics of a patterned photoresist layer. For example, criticaldimensions (e.g., line widths) of patterned features can be studied.Alternatively, or additionally, the interferometry techniques can beused to determine overlay error between the features in the patternedresist and features beneath the photoresist layer. Again, where measuredcritical dimensions and/or overlay error are outside process windows,the patterned photoresist can be stripped from the substrate and a newpatterned photoresist layer formed.

In certain embodiments, the interferometry techniques can be used inconjunction with half-tone photolithography. Increasingly, half-tonephotolithography is used where specific thickness variations in thefeatures of a patterned resist layer are desired. The low coherenceinterferometry techniques disclosed herein can be used to monitorthickness profiles of photoresist patterns in half-tone regions. Inaddition, the techniques can be used to determine both overlay andcritical dimensions of these features.

In some embodiments, the interferometry techniques can be used to detectcontaminants (e.g., foreign particles) at different stages on the glassplates at different stages of the production process. Such contaminantscan give rise to visual defects (i.e., mura defects) in display panels,ultimately affecting the manufacturer's yield. Often, such defects areonly detected by visual inspection, usually performed after the panelhas been assembled. The interferometry techniques disclosed herein canbe used to perform automated inspection of the glass plates at one ormore points during the production process. Where particles are detected,the contaminated surface of the glass plate can be cleaned before thenext production step. Accordingly, use of the techniques can reduce theoccurrence of mura defects in panels, improving panel quality andreducing manufacturing costs.

Among other factors, the electrooptic properties (e.g., the contrastratio and brightness) are dependent on the cell gap Δg. Cell gap controlduring manufacturing is often critical to obtaining uniform, qualitydisplays. In certain embodiments, the disclosed interferometrytechniques can be used to ensure that cell gap has desired uniformity.For example, the techniques can be used to monitor the height and/orposition of spacers on a glass plate. Monitoring and controlling spacerheight, for example, can reduce cell gap variations across a display.

In some cases, the actual cell gap may differ from the dimensions ofspacers because, during assembly, pressure or vacuum is applied tointroduce the liquid crystal medium, the edge seals cure and may changedimensions, and the added liquid crystal material can generatescapillary forces between the glass plates. Both before and after addingthe liquid crystal matter, the surfaces of the exposed layers on theglass plates reflect light that results in an interference patternindicative of the cell gap Δg. The low coherence nature of theinterference signal either itself or in combination with the describedinterference signal processing techniques can be used to monitorproperties of the cell including the cell gap Δg during manufacture evenin the presence of interfaces formed by other layers of the cell.

An exemplary method can include obtaining a low coherence interferencesignal including interference patterns indicative of the cell gap Δgprior to adding the liquid crystal material. The cell gap (or otherspatial property of the cell) is determined from the interferencepatterns and can be compared to a specified value. Manufacturingconditions, e.g., a pressure or vacuum applied to the glass plates canbe changed to modify the cell gap Δg if a difference between thespecified value and the determined cell gap exceeds tolerances. Thisprocess can be repeated until achieving the desired cell gap. Liquidcrystal material is then introduced into the cell. The amount of liquidcrystal medium to be added can be determined from the measured spatialproperty of the cell. This can avoid over- or underfilling the cell. Thefilling process can also be monitored by observing interference signalsfrom the surfaces of the exposed layers on the glass plates. Once thecell has been filed, additional low coherence interference patterns areobtained to monitor the cell gap Δg (or other spatial property). Again,the manufacturing conditions can be changed so that the cell gap ismaintained or brought within tolerances.

In certain LCDs, the alignment layers include protruding structures thatprovide desired alignment characteristics to the liquid crystalmaterial. For example, some LCDs have more than one alignment domain foreach pixel of the display where protruding alignment structures providethe different align domains. Low coherence interferometry can be used tomeasure various properties of the protrusions, such as, for example,their shape, line width, height, and/or overlay error with respect tounderlying features of the LCD panel. Where the protrusions aredetermined to be unsatisfactory, they can be repaired or removed andrebuilt as necessary.

In general, low coherence interferometry systems can be set up tomonitor various stages of LCD panel production as desired. In someembodiments, inspection stations including an interferometry system canbe set up in the manufacturing line itself. For example, monitoringstations can be installed in the clean manufacturing environment wherethe photolithography steps are performed. Delivery of the glass platesto and from the inspection stations can be entirely automated, beingperformed robotically. Alternatively, or additionally, inspectionstations can be established removed from the manufacturing line. Forexample, where only a sampling of the displays are to be tested, thesamples can be retrieved from the manufacturing line and taken offlinefor testing.

Referring to FIG. 23C, an exemplary inspection station 4000 includes atable 4030, which includes a gantry 4020 on which an interferometricsensor 4010 (e.g., an interferometric microscope, such as disclosedpreviously) is mounted. Table 4030 (which can include vibrationisolation bearings) supports a LCD panel 4001 (or glass plate) andpositions panel 4001 with respect to sensor 4010. Sensor 4010 is mountedto gantry 4020 via a rail that allows the sensor to move back and forthin the direction of arrow 4012. Gantry 4020 is mounted on table 4030 onrails that allows the gantry to move back and forth in the direction ofarrow 4014. In this way, inspection station 4000 can move sensor 4010 toinspect any location on display panel 4001.

Station 4000 also includes control electronics 4050 which controls thepositioning system for sensor 4010 and acquires the signals from sensor4010 that include information about panel 4001. In this way, controlelectronics 4050 can coordinate sensor positioning with dataacquisition.

Laser Scribing and Cutting

Lasers can be used to scribe objects in preparation for separatingdifferent, concurrently manufactured structures, e.g., microelectronicsstructures. The quality of separation is related to the scribingconditions, e.g., laser focus size, laser power, translation rate of theobject, and scribe depth. Because the density of features of thestructure may be large, the scribe lines may be adjacent thin film orlayers of the structures. Interfaces associated with the thin film orlayers may create interference patterns that appear when interferometryis used to determine the scribe depth. The methods and systems describedherein can be used to determine the scribe depth even in the presence ofsuch adjacent films or layers.

An exemplary method can include scribing one or more electronicstructures and separating the structures along the scribe lines. Beforeand/or after separation, low coherence interference signals can be usedto determine the depth of scribe. Other scribing conditions are known,e.g., laser spot size, laser power, translation rate. The scribe depthcan be determined from the interference signals. The quality ofseparation as a function of the scribing conditions, including thescribe depth, can be determined by evaluating the separated structures.Based on such determinations, the scribing conditions necessary toachieve a desired separation quality can be determined. During continuedmanufacturing, low coherence interference signals can be obtained fromscribed regions to monitor the process. Scribing conditions can bechanged to maintain or bring the scribe properties within tolerances.

A number of embodiments of the invention have been described. Otherembodiments are in the claims.

1. An apparatus, comprising: a microscope comprising an objective and astage for positioning a test object relative to the objective, the stagebeing moveable with respect to the objective; and a sensor system,comprising: a sensor light source; an interferometric sensor configuredto receive light from the sensor light source, to introduce an opticalpath difference (OPD) between a first portion and a second portion ofthe light, the OPD being related to a distance between the objectivelens and the stage, and to combine the first and second portions of thelight to provide output light; a detector configured to detect theoutput light from the interferometric sensor; a fiber waveguideconfigured to direct light between the sensor light source, theinterferometric sensor and the detector; a tunable optical cavity in apath of the light from the sensor light source and the interferometricsensor; and an electronic controller in communication with the detector,the electronic controller being configured to determine informationrelated to the OPD based on the detected output light.
 2. The apparatusof claim 1, wherein the electronic controller is configured to adjust afocus of the microscope relative to the test object based on theinformation.
 3. The apparatus of claim 1, wherein during operation theapparatus determines information about the test object using themicroscope, where determining the information about the test objectincludes reducing errors due to vibrations in the apparatus using theinformation related to the OPD determined by the electronic controller.4. The apparatus of claim 1, wherein the microscope is aninterferometric microscope.
 5. The apparatus of claim 4, wherein theinterferometric microscope is a scanning white light interferometry(SWLI) microscope.
 6. The apparatus of claim 4, wherein theinterferometric microscope is a pupil plane SWLI microscope.
 7. Theapparatus of claim 4, wherein the interferometric microscope isconfigured to determine information about a test object positioned onthe stage by illuminating the test object with test light and tocombining the test light with reference light from a reference object toform an interference pattern on a detector, wherein the test light andreference light are derived from a common source, and the apparatus isconfigured to reduce uncertainty in the information about the testobject due to scan errors based on the determined information related tothe sensor OPD.
 8. The apparatus of claim 1, wherein the sensor systemcomprises one or more additional interferometric sensors each configuredto receive light from the sensor light source.
 9. The apparatus of claim8, wherein each interferometric sensor is configured to introduce an OPDbetween two components of its corresponding light, each OPD beingrelated to a corresponding displacement between the objective and thestage along a corresponding axis.
 10. The apparatus of claim 9, whereinthe electronic controller is configured to determine information about atilt of the stage relative to the objective based on determininginformation related to the corresponding OPD for at least two of theinterferometric sensors.
 11. The apparatus of claim 8, wherein thesensor system comprises one or more additional detectors, eachconfigured to receive output light from a corresponding interferometricsensor.
 12. The apparatus of claim 11, wherein each additionalinterferometric sensor receives light from the sensor light source anddirects output light to its corresponding sensor through a correspondingfiber waveguide.
 13. The apparatus of claim 11, wherein the tunableoptical cavity is in the path of the light from the sensor light sourceto each interferometric sensor.
 14. The apparatus of claim 1, whereinthe interferometric sensor comprises a lens positioned to receive lightexiting the fiber waveguide and to focus the light to a waist.
 15. Theapparatus of claim 14, wherein the lens is a graded index lens.
 16. Theapparatus of claim 14, wherein the lens is attached to the objective.17. The apparatus of claim 14, wherein the lens is attached to thestage.
 18. The apparatus of claim 1, wherein the microscope comprises amicroscope light source and the objective comprises one or more opticalelements, the microscope being configured to deliver light from themicroscope light source to the test object and the one or more opticalelements being configured to collect light from the test object, and theinterferometric sensor is configured to direct light to the stagethrough the one or more optical elements of the objective.
 19. Theapparatus of claim 1, wherein the sensor light source is a broadbandlight source.
 20. The apparatus of claim 1, wherein the sensor lightsource has a peak intensity at a wavelength in a range from 900 nm to1,600 nm.
 21. The apparatus of claim 1, wherein the sensor light sourcehas a full-width at half maximum of 50 nm or less.
 22. The apparatus ofclaim 1, wherein the sensor light source has a coherence length of about100 microns or less.
 23. The apparatus of claim 1, wherein the tunableoptical cavity comprises two optical paths for the light, each pathcomprising a fiber stretcher module.
 24. The apparatus of claim 1,wherein the sensor light source and the detector are located in ahousing separate from the microscope.
 25. The apparatus of claim 1,wherein the information is about a displacement between the objectivelens and the stage along an axis.
 26. The apparatus of claim 25, whereinthe microscope is configured to scan the stage parallel to the axis. 27.The apparatus of claim 25, wherein the information is about an absolutedisplacement between the objective lens and the stage.
 28. The apparatusof claim 25, wherein the information is about a relative distancebetween the objective lens and the stage.
 29. The apparatus of claim 1,wherein the microscope comprises a microscope light source and isconfigured to deliver light from the microscope light source to a testobject located on the stage, wherein a wavelength of peak intensity ofthe microscope light source is about 100 nm or more from a wavelength ofpeak intensity of the sensor light source.
 30. The apparatus of claim29, wherein the wavelength of peak intensity of the microscope lightsource is in a range from 300 nm to 700 nm and the wavelength of peakintensity of the sensor light source is in a range from 900 nm to 1,600nm.
 31. A system, comprising: the apparatus of claim 1; one or moreadditional microscopes each comprising a corresponding objective and acorresponding stage, wherein the sensor system comprises one or moreadditional interferometric sensors each associated with one of the oneor more additional microscopes, each additional interferometric sensorbeing configured to receive light from the sensor light source.
 32. Thesystem of claim 31, wherein each of the one or more additionalinterferometric sensors is configured to introduce an optical pathdifference (OPD) between a first portion and a second portion of thelight from the light source, the OPD being related to a distance betweenthe objective lens and the stage of the microscope with which the sensoris associated, and to combine the first and second portions of the lightto provide output light.
 33. The system of claim 32, wherein the sensorsystem comprises one or more additional detectors, each configured todetect the output light from a corresponding one of the additionalinterferometric sensors.
 34. The system of claim 31, wherein the sensorsystem comprises one or more fiber waveguides configured to direct lightbetween the sensor light source and the one or more additionalinterferometric sensors.
 35. The system of claim 31, wherein each of themicroscopes is arranged to inspect a different test object.